The **ATS-08D-174-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) and other heat-generating components. --- ### 1. Technical Specifications The following table highlights the primary mechanical and thermal properties of this specific part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Thermal Resistance** | 4.02°C/W (at 100 LFM) | | **Footprint (L x W)** | 30.00mm x 30.00mm | | **Height** | 25.00mm | --- ### 2. Key Features and Design #### **Fin Design (Cross-Cut)** The "174" series typically utilizes a **cross-cut** or high-density fin pattern. This design increases the surface area available for heat exchange and is optimized for airflow from multiple directions, making it ideal for high-component-density PCBs. #### **Attachment Mechanism: pushPIN™** The part uses a push-pin attachment system rather than thermal adhesive. This provides several advantages: * **Constant Pressure:** A compression spring ensures consistent contact between the heat sink and the component, maximizing thermal transfer. * **Reliability:** It is more resistant to shock and vibration compared to adhesive tapes. * **Ease of Installation:** Pre-drilled holes in the PCB allow for quick assembly. #### **Thermal Interface Material (TIM)** The suffix **R0** indicates that the part comes with a pre-applied **Phase Change Material (PCM)** or high-performance thermal pad. This eliminates the need for manual application of thermal grease and ensures a uniform bond. --- ### 3. Application Use Cases The ATS-08D-174-C2-R0 is commonly found in the following electronic environments: * **Telecommunications:** Cooling small-form-factor routers and switches. * **Embedded Systems:** Cooling SoCs (System on Chips) and FPGAs. * **Power Supplies:** Managing heat for MOSFETs or power regulators. * **Industrial Controls:** Protecting sensitive electronics in compact enclosures. ---