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  • ATS-08D-177-C2-R0

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    The **ATS-08D-177-C2-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **blueICE™** or **pushPIN™** series, designed specifically for cooling electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-08D-177-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 6.18°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 35mm x 35mm x 20mm | | **Fin Style** | Straight Fin | --- ### 2. Electronic/Physical Characteristics #### A. Thermal Management (C2 Grade) The "C2" suffix typically denotes the **Thermal Interface Material (TIM)** provided with the part. In this case, it usually comes with **T766**, a high-performance phase-change material or thermal grease pre-applied to the base to ensure minimal air gaps between the component and the heat sink. #### B. Mounting System (pushPIN™) The "08D" series utilizes a specialized mounting mechanism: * **Pressure-fit:** Uses a brass or plastic pin with a stainless steel spring. * **PCB Holes:** Requires specific hole diameters (typically 3mm) drilled into the PCB. * **Even Pressure:** Ensures consistent contact pressure across the electronic chip, preventing "tilting" which can cause localized overheating. #### C. Airflow Dynamics The straight fin design is optimized for **forced air cooling**. * **LFM (Linear Feet per Minute):** The effectiveness increases significantly as airflow increases. At 100 LFM, the resistance is ~6.18°C/W, but at 500 LFM, it can drop to approximately ~2.50°C/W. --- ### 3. Common Applications This part is commonly used to protect sensitive electronic semiconductors in the following devices: * **Networking:** Routers, switches, and load balancers. * **Embedded Systems:** Industrial PCs and single-board computers (SBCs). * **Power Electronics:** Voltage regulators and high-current power modules. --- ### 4. Part Number Breakdown ```text ATS - 08 D - 177 - C2 - R0 | | | | | | | | | +-- Revision Code | | | +------- Thermal Interface Material (T766) | | +------------- Dimensions/Fin Height Code | +-------------------- pushPIN™ Attachment Series +-------------------------- Advanced Thermal Solutions (Manufacturer) ```
    ✨ Follow-up Questions
    • ⤷What is the difference between straight fin and cross-cut fin heat sinks?
    • ⤷ How do I calculate the required LFM for my specific electronic component?
    • ⤷ What are the PCB hole requirements for the pushPIN™ mounting system?