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The **ATS-08D-177-C2-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **blueICE™** or **pushPIN™** series, designed specifically for cooling electronic components like CPUs, GPUs, or high-power transistors.
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### 1. Technical Specifications
| Parameter | Specification |
| :--- | :--- |
| **Part Number** | ATS-08D-177-C2-R0 |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | 6.18°C/W (at 100 LFM) |
| **Dimensions (L x W x H)** | 35mm x 35mm x 20mm |
| **Fin Style** | Straight Fin |
---
### 2. Electronic/Physical Characteristics
#### A. Thermal Management (C2 Grade)
The "C2" suffix typically denotes the **Thermal Interface Material (TIM)** provided with the part. In this case, it usually comes with **T766**, a high-performance phase-change material or thermal grease pre-applied to the base to ensure minimal air gaps between the component and the heat sink.
#### B. Mounting System (pushPIN™)
The "08D" series utilizes a specialized mounting mechanism:
* **Pressure-fit:** Uses a brass or plastic pin with a stainless steel spring.
* **PCB Holes:** Requires specific hole diameters (typically 3mm) drilled into the PCB.
* **Even Pressure:** Ensures consistent contact pressure across the electronic chip, preventing "tilting" which can cause localized overheating.
#### C. Airflow Dynamics
The straight fin design is optimized for **forced air cooling**.
* **LFM (Linear Feet per Minute):** The effectiveness increases significantly as airflow increases. At 100 LFM, the resistance is ~6.18°C/W, but at 500 LFM, it can drop to approximately ~2.50°C/W.
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### 3. Common Applications
This part is commonly used to protect sensitive electronic semiconductors in the following devices:
* **Networking:** Routers, switches, and load balancers.
* **Embedded Systems:** Industrial PCs and single-board computers (SBCs).
* **Power Electronics:** Voltage regulators and high-current power modules.
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### 4. Part Number Breakdown
```text
ATS - 08 D - 177 - C2 - R0
| | | | |
| | | | +-- Revision Code
| | | +------- Thermal Interface Material (T766)
| | +------------- Dimensions/Fin Height Code
| +-------------------- pushPIN™ Attachment Series
+-------------------------- Advanced Thermal Solutions (Manufacturer)
```
- ⤷What is the difference between straight fin and cross-cut fin heat sinks?
- ⤷ How do I calculate the required LFM for my specific electronic component?
- ⤷ What are the PCB hole requirements for the pushPIN™ mounting system?