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  • ATS-08D-182-C1-R0

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    The **ATS-08D-182-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) to prevent overheating. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific model: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimensions (L x W)** | 40.00mm x 40.00mm | | **Height (H)** | 15.00mm | | **Pitch** | Fine-Pitch | | **Pattern** | XC-CUT | --- ### 2. Design Characteristics This part belongs to the **pushPIN™** family, which features a specific mounting mechanism designed for secure attachment to a Printed Circuit Board (PCB). * **Heat Dissipation Pattern (XC-CUT):** The "XC" pattern refers to the cross-cut fin geometry. This design increases surface area and allows for multi-directional airflow, making it efficient in systems where air direction might change. * **Thermal Interface Material (TIM):** This specific model typically comes with **T412** thermal tape or pre-applied grease, ensuring high conductivity between the heat source (the chip) and the aluminum base. * **Fine-Pitch Fins:** The fins are spaced closely together to maximize heat transfer in environments with forced air (fans). --- ### 3. Part Number Breakdown The part number can be decoded as follows: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **08** | Series Identifier | | **D** | Attachment Type (pushPIN) | | **182** | Specific internal dimension/geometry code | | **C1** | Thermal Performance Class (Low/Medium/High) | | **R0** | RoHS Compliant / Revision code | --- ### 4. Typical Applications * **CPUs/GPUs:** Cooling small processors or graphic chips. * **FPGAs:** Managing heat in field-programmable gate arrays. * **Telecommunications:** Used in routers and switches. * **Embedded Systems:** Industrial PCs and automation controllers.
    ✨ Follow-up Questions
    • ⤷ What are the specific thermal resistance ratings for this heat sink?
    • ⤷ How do pushPIN attachments compare to standard adhesive backing?
    • ⤷ Is there a taller version of this heat sink for higher heat loads?