ATS-08D-182-C1-R0
AI

The **ATS-08D-182-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) to prevent overheating.
---
### 1. Technical Specifications
The following table outlines the physical and thermal properties of this specific model:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. |
| **Series** | pushPIN™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded pins) |
| **Dimensions (L x W)** | 40.00mm x 40.00mm |
| **Height (H)** | 15.00mm |
| **Pitch** | Fine-Pitch |
| **Pattern** | XC-CUT |
---
### 2. Design Characteristics
This part belongs to the **pushPIN™** family, which features a specific mounting mechanism designed for secure attachment to a Printed Circuit Board (PCB).
* **Heat Dissipation Pattern (XC-CUT):** The "XC" pattern refers to the cross-cut fin geometry. This design increases surface area and allows for multi-directional airflow, making it efficient in systems where air direction might change.
* **Thermal Interface Material (TIM):** This specific model typically comes with **T412** thermal tape or pre-applied grease, ensuring high conductivity between the heat source (the chip) and the aluminum base.
* **Fine-Pitch Fins:** The fins are spaced closely together to maximize heat transfer in environments with forced air (fans).
---
### 3. Part Number Breakdown
The part number can be decoded as follows:
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer (Advanced Thermal Solutions) |
| **08** | Series Identifier |
| **D** | Attachment Type (pushPIN) |
| **182** | Specific internal dimension/geometry code |
| **C1** | Thermal Performance Class (Low/Medium/High) |
| **R0** | RoHS Compliant / Revision code |
---
### 4. Typical Applications
* **CPUs/GPUs:** Cooling small processors or graphic chips.
* **FPGAs:** Managing heat in field-programmable gate arrays.
* **Telecommunications:** Used in routers and switches.
* **Embedded Systems:** Industrial PCs and automation controllers.
- ⤷
What are the specific thermal resistance ratings for this heat sink?
- ⤷ How do pushPIN attachments compare to standard adhesive backing?
- ⤷ Is there a taller version of this heat sink for higher heat loads?