ATS-08D-206-C2-R0
AI

The **ATS-08D-206-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the *pushPIN™* series and is designed for efficient thermal management of electronic components like CPUs, GPUs, or power transistors.
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### 1. Key Technical Specifications
Below are the primary physical and thermal characteristics of this component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (Body), Blue Anodized (Finish) |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W x H)** | 60.00mm x 60.00mm x 10.00mm |
| **Fin Style** | Straight Fin |
| **Pitch** | Coarse Pitch |
| **Thermal Resistance** | 7.71 °C/W (at 100 LFM) |
| **Thermal Interface Material (TIM)** | T766 (High Performance) |
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### 2. Physical Design Details
The "Electronic Parts" of this assembly are categorized into the heat-dissipating body and the mechanical attachment system:
* **Heat Sink Body:**
* Crafted from aluminum for optimal weight-to-thermal conductivity ratio.
* The **Low Profile (10mm height)** makes it ideal for dense server environments or small form-factor (SFF) electronics.
* **pushPIN™ Attachment:**
* Features a flexible, tool-free installation mechanism.
* Pre-drilled holes in the PCB allow the spring-loaded pins to snap in, providing consistent pressure on the electronic chip.
* **Compression Springs:**
* Ensures a secure fit even during mechanical shocks or vibrations.
* **Thermal Interface Material (TIM):**
* Comes pre-applied with **T766**, a specialized thermal grease/pad that fills microscopic air gaps between the component and the heat sink.
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### 3. Thermal Performance Metrics
The cooling efficiency depends on the Airflow (measured in Linear Feet per Minute - LFM):
| Airflow Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| **100 (0.5 m/s)** | 7.71 |
| **300 (1.5 m/s)** | 3.53 |
| **500 (2.5 m/s)** | 2.50 |
| **700 (3.5 m/s)** | 2.01 |
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### 4. Part Number Breakdown
Understanding the code `ATS-08D-206-C2-R0`:
* **ATS:** Manufacturer (Advanced Thermal Solutions).
* **08:** Designates the specific series or fin geometry.
* **D:** Attachment type (In this case, pushPIN™).
* **206:** Unique designator for the dimensions (60x60x10mm).
* **C2:** Material/Finish code (Blue Anodized).
* **R0:** Revision or packaging status.
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What are the advantages of using pushPIN™ over traditional screw-mount heat sinks?
- ⤷ How does the T766 thermal interface material compare to standard thermal paste?
- ⤷ Is there a version of this heat sink with a higher profile for better passive cooling?