Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-08D-26-C2-R0

  • AI
    The **ATS-08D-26-C2-R0** is a high-performance electronic thermal management component manufactured by **Advanced Thermal Solutions (ATS)**. Specifically, it is a heat sink from the "blueICE" series designed for cooling electronic integrated circuits (ICs). --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Product Type** | Heat Sink | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 70mm x 70mm x 10mm | | **Attachment Method** | Push-pin (Brass) | | **Thermal Resistance** | 14.22°C/W (Unducted Flow @ 100 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Design and Components This part is engineered for precision cooling in space-constrained environments: * **Fins:** It utilizes a **Fine Pitch** design. The high density of fins increases the total surface area, allowing for better heat dissipation into the surrounding air. * **Push-Pin Attachment:** The assembly includes a brass push-pin mechanism and a high-performance compression spring. This ensures a secure fit and constant pressure against the chip for optimal heat transfer. * **Thermal Interface Material (TIM):** It comes with **T766** pre-applied to the base. This material fills microscopic air gaps between the heat sink and the component (like a CPU or FPGA) to maximize thermal conductivity. --- ### 3. Application Use-Cases The ATS-08D-26-C2-R0 is typically used in industrial and high-speed computing environments where heat management is critical: 1. **Network Switches/Routers:** Cooling high-speed processors. 2. **Embedded Systems:** For industrial PCs where vertical space (10mm height) is limited. 3. **Power Supplies:** Managing heat on MOSFETs or large voltage regulators. --- ### 4. Thermal Performance Data Performance varies based on the airflow (velocity) within the electronic enclosure: | Air Velocity (LFM) | 100 (0.5 m/s) | 300 (1.5 m/s) | 500 (2.5 m/s) | | :--- | :--- | :--- | :--- | | **Thermal Resistance (°C/W)** | 14.22 | 3.96 | 2.02 |
    ✨ Follow-up Questions
    • ⤷ What is the significance of the 'Blue Anodized' finish on this heat sink?
    • ⤷ How does the push-pin mounting compare to adhesive thermal tape?
    • ⤷ Can this heat sink be used for passive cooling without a fan?