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  • ATS-08D-30-C3-R0

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    The **ATS-08D-30-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) and other surface-mount components. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Parameter | Specification | | :--- | :--- | | **Product Type** | push-PIN™ Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 70mm x 70mm x 25mm | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance (Unducted)** | 5.35 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 0.81 °C/W @ 200 LFM | | **Fin Style** | Straight Fin | --- ### 2. Key Features * **push-PIN™ Mounting:** Utilizes a spring-loaded attachment mechanism. This ensures a consistent pressure on the heat source, optimizing the interface between the chip and the heat sink. * **Straight Fin Design:** This geometry is optimized for high-velocity airflow environments (ducted or active cooling). * **Pre-Applied Thermal Interface Material (TIM):** Most versions come with a pre-applied Phase Change Material or thermal grease to simplify the assembly process. * **Lightweight:** Being made of aluminum, it provides a high strength-to-weight ratio, reducing mechanical stress on the PCB. --- ### 3. Application Use Cases This specific heat sink is typically used in the following electronic sectors: 1. **Telecommunications:** High-speed routers and switches. 2. **Embedded Computing:** Industrial PC boards and single-board computers (SBCs). 3. **Power Electronics:** Large MOSFET or IGBT arrays that require passive dissipation. 4. **FPGA/ASIC Cooling:** Cooling high-gate-count chips that generate significant heat during operation. --- ### 4. Thermal Performance Visualization Depending on the airflow (measured in Linear Feet per Minute - LFM), the thermal resistance changes significantly: ```python # Approximate performance data for ATS-08D-30-C3-R0 performance_data = { "100_LFM": 5.35, # °C/W "200_LFM": 3.42, # °C/W "300_LFM": 2.85, # °C/W "400_LFM": 2.54, # °C/W "500_LFM": 2.32 # °C/W } ```
    ✨ Follow-up Questions
    • ⤷ What are the compatible PCB hole sizes for the push-pin mounting of this heat sink?
    • ⤷ How does the Blue Anodized finish affect the thermal emissivity of the part?
    • ⤷ Is there a weight difference between the plastic and brass push-pin options?