ATS-08D-30-C3-R0
AI

The **ATS-08D-30-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) and other surface-mount components.
---
### 1. Technical Specifications
The part number follows a specific nomenclature that defines its physical and thermal characteristics:
| Parameter | Specification |
| :--- | :--- |
| **Product Type** | push-PIN™ Heat Sink |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions** | 70mm x 70mm x 25mm |
| **Attachment Method** | Push-Pin (Plastic or Brass) |
| **Thermal Resistance (Unducted)** | 5.35 °C/W @ 100 LFM |
| **Thermal Resistance (Ducted)** | 0.81 °C/W @ 200 LFM |
| **Fin Style** | Straight Fin |
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### 2. Key Features
* **push-PIN™ Mounting:** Utilizes a spring-loaded attachment mechanism. This ensures a consistent pressure on the heat source, optimizing the interface between the chip and the heat sink.
* **Straight Fin Design:** This geometry is optimized for high-velocity airflow environments (ducted or active cooling).
* **Pre-Applied Thermal Interface Material (TIM):** Most versions come with a pre-applied Phase Change Material or thermal grease to simplify the assembly process.
* **Lightweight:** Being made of aluminum, it provides a high strength-to-weight ratio, reducing mechanical stress on the PCB.
---
### 3. Application Use Cases
This specific heat sink is typically used in the following electronic sectors:
1. **Telecommunications:** High-speed routers and switches.
2. **Embedded Computing:** Industrial PC boards and single-board computers (SBCs).
3. **Power Electronics:** Large MOSFET or IGBT arrays that require passive dissipation.
4. **FPGA/ASIC Cooling:** Cooling high-gate-count chips that generate significant heat during operation.
---
### 4. Thermal Performance Visualization
Depending on the airflow (measured in Linear Feet per Minute - LFM), the thermal resistance changes significantly:
```python
# Approximate performance data for ATS-08D-30-C3-R0
performance_data = {
"100_LFM": 5.35, # °C/W
"200_LFM": 3.42, # °C/W
"300_LFM": 2.85, # °C/W
"400_LFM": 2.54, # °C/W
"500_LFM": 2.32 # °C/W
}
```
- ⤷
What are the compatible PCB hole sizes for the push-pin mounting of this heat sink?
- ⤷ How does the Blue Anodized finish affect the thermal emissivity of the part?
- ⤷ Is there a weight difference between the plastic and brass push-pin options?