The **ATS-08D-32-C3-R0** is a high-performance electronic thermal management component, specifically a **Pin-Fin Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 12.70mm | | **Thermal Resistance** | 21.54 °C/W (Natural) / 1.17 °C/W (3.0 m/s) | | **Fin Style** | Square Pin-Fin | | **Compliance** | RoHS Compliant | --- ### Key Electronic & Mechanical Components #### 1. Pin-Fin Geometry Unlike traditional straight-fin heat sinks, the **Pin-Fin** design features a grid of vertical pins. This increases the surface area and creates turbulence in the airflow, which significantly enhances heat transfer in environments where the airflow direction might be inconsistent. #### 2. pushPIN™ Attachment System The "R0" in the part number indicates a specific attachment kit. This system uses: * **Brass Bolts/Pins:** To secure the sink to the PCB. * **Compression Springs:** To provide precise, uniform pressure (Force) on the electronic component, ensuring optimal contact with the Thermal Interface Material (TIM). #### 3. Thermal Interface Material (TIM) The "C3" designation typically refers to the pre-applied thermal material. In this series, it usually indicates **T766** phase-change material or a high-performance thermal grease, which fills microscopic air gaps between the chip and the heat sink base. --- ### Thermal Performance Overview | Airflow Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | | 1.0 (200 LFM) | 2.51 | | 2.0 (400 LFM) | 1.51 | | 3.0 (600 LFM) | 1.17 | --- ### Typical Applications * **Embedded Systems:** Cooling processors in industrial computers. * **Telecommunications:** Managing heat in high-speed networking switches. * **Power Electronics:** Dissipating heat from large MOSFETs or IGBT modules.