The **ATS-08D-36-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (High Performance) | | **Attachment Method** | pushPIN™ (Spring Loaded) | | **Thermal Resistance** | 1.50°C/W @ 200 LFM (Linear Feet per Minute) | | **Dimensions (L x W x H)** | 36.83mm x 36.83mm x 12.70mm | | **Finish** | Blue Anodized | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ### 2. Key Electronic Features #### A. pushPIN™ Attachment System The part number signifies the inclusion of a specialized **pushPIN™** system. This ensures consistent pressure across the surface of the electronic chip, which is critical for maximizing heat transfer and preventing the component from cracking due to uneven weight distribution. #### B. Flared Fin Design The "maxiFLOW" geometry features fins that are slightly flared. This design: * Reduces pressure drop across the heat sink. * Increases the surface area for air-to-metal contact. * Improves cooling efficiency in environments with constrained airflow. #### C. T412 Thermal Interface Material The unit comes with **T412** pre-applied to the base. This is a high-performance phase-change material that fills microscopic air gaps between the heat sink and the electronic component, ensuring the lowest possible thermal resistance. --- ### 3. Application Use Cases * **Networking Equipment:** Switches and routers where high-density components generate significant heat. * **Embedded Systems:** Industrial PCs where space is limited but thermal loads are high. * **Power Electronics:** Cooling MOSFETs or voltage regulators in power supply units.