The **ATS-08D-38-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed for cooling high-heat-generating electronic components such as CPUs, GPUs, and power transistors. --- ### 1. Technical Specifications The model number encodes specific data about the heat sink's dimensions and physical properties: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Anodized Blue) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 25.00mm | | **Attachment Method** | **push-PIN™** (Plastic Pins with Springs) | | **Fin Pattern** | Fine-Pitch (High density for airflow) | | **Thermal Resistance** | ~6.50° C/W (at 1.0 m/s airflow) | | **Thermal Interface Material** | T412 (Pre-applied thermal tape/pad) | --- ### 2. Physical Design & Engineering The "D" in the part number indicates a specific fin geometry and density. This part utilizes a **straight-fin** or **cross-cut** design depending on the specific sub-series, optimized for vertical airflow. #### Key Physical Components: 1. **Heat Sink Body:** Constructed from extruded aluminum to balance weight and thermal conductivity. 2. **Blue Anodized Finish:** Provides a protective layer against corrosion and slightly improves radiative heat transfer. 3. **push-PIN™ Attachment:** * Features a flexible attachment mechanism that ensures constant pressure on the electronic chip. * Requires pre-drilled holes in the Printed Circuit Board (PCB). 4. **Springs:** Provides a precise "Pre-load" force to ensure maximum contact between the chip and the heat sink base. --- ### 3. Application Use Cases This component is typically found in the following electronic environments: * **Networking Equipment:** Switches and routers where high-speed processors require active or passive cooling. * **Embedded Systems:** Industrial PCs that run in enclosed environments. * **Power Supplies:** Cooling MOSFETs or voltage regulators. --- ### 4. Thermal Performance Data *Approximate performance based on airflow (LFM - Linear Feet per Minute):* | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 6.50 | | 400 (2.0 m/s) | 2.10 | | 600 (3.0 m/s) | 1.60 |