The **ATS-08D-40-C3-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Push-Pin Heat Sink**. It is designed to dissipate heat from surface-mount components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 54mm x 54mm x 15mm | | **Fin Style** | XC (Cross-Cut) | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | 1.47°C/W (at 200 LFM) | | **Thermal Interface Material** | T412 (Phase Change) | --- ### 2. Design and Component Breakdown #### A. Fin Geometry (Cross-Cut) The "XC" designation refers to the **Cross-Cut** fin pattern. Unlike straight fins, cross-cut fins allow for multi-directional airflow. This is critical in dense electronic enclosures where the direction of the system fan's airflow may be unpredictable or turbulent. #### B. Attachment Mechanism (Push-Pin) This part utilizes a **Brass Push-Pin** with a compression spring. * **Purpose:** It ensures a constant, high-pressure contact between the heat sink base and the electronic chip. * **Installation:** Requires pre-drilled holes in the Printed Circuit Board (PCB). The spring provides a specific "clamping force" to prevent the heat sink from shifting during vibration or shipping. #### C. Thermal Interface Material (TIM) The part comes pre-applied with **T412 thermal tape/grease**. * This material fills the microscopic air gaps between the chip and the heat sink. * It is a phase-change material that improves heat transfer efficiency once the component reaches operating temperature. --- ### 3. Part Number Breakdown (Nomenclature) The SKU follows the standard ATS naming convention: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **08D** | Series/Pin Type (specific spring/pin combination) | | **40** | Length/Width (indicates the 54mm base size category) | | **C3** | Thermal Performance/Fin Density code | | **R0** | RoHS Compliant and revision status | --- ### 4. Application Use-Case This heat sink is typically found in: * **Networking Equipment:** Routers and switches. * **Industrial PCs:** High-heat processors in fan-restricted environments. * **Power Supplies:** Cooling MOSFETs or power regulators.