ATS-08D-41-C1-R0
AI

The **ATS-08D-41-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is designed for cooling electronic components, specifically those in BGA (Ball Grid Array) packages.
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## 1. Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Product Series** | pushPIN™ Heat Sink |
| **Attachment Method** | Push-Pin (Plastic) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Thermal Resistance** | 10.02°C/W (Unducted Flow @ 100 LFM) |
| **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 25.00mm |
| **Pitch** | Fine Pitch |
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## 2. Key Components and Design Features
### A. Push-Pin Mounting System
This model uses a **push-pin** mechanism rather than adhesive or clips.
* **Spring-loaded mechanism:** Provides consistent pressure for optimal thermal interface material (TIM) performance.
* **Reliability:** Reduces the risk of the heat sink shifting during mechanical vibration or shipping.
### B. Fin Design
* **Fine Pitch:** The "41" in the part number indicates a specific fin pattern designed for maximum surface area.
* **Airflow Optimization:** These fins are engineered to dissipate heat effectively in both natural convection and forced-air (fan) environments.
### C. Thermal Interface Material (TIM)
* **Pre-applied:** Usually comes with a high-performance thermal interface material (like T766) pre-applied to the base to simplify assembly and ensure uniform heat transfer from the chip to the aluminum.
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## 3. Application Use Cases
The ATS-08D-41-C1-R0 is typically used for the following electronic parts:
1. **CPUs and GPUs:** In embedded systems or industrial PCs.
2. **FPGAs/ASICs:** In networking gear or high-speed data processing units.
3. **Power Electronics:** Components that generate significant heat within a 40mm x 40mm footprint.
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## 4. Part Number Breakdown
```text
ATS - 08 D - 41 - C1 - R0
| | | | |
| | | | +-- Revision Code
| | | +------- Color/Finish (Blue Anodized)
| | +------------ Fin Pattern/Height Code
| +------------------ Mechanical Attachment Type
+------------------------ Manufacturer (Advanced Thermal Solutions)
```
- ⤷
What is the hole pattern requirement for mounting this heat sink?
- ⤷ How does the thermal resistance change at 400 LFM airflow?
- ⤷ Is there a version of this heat sink for larger 50mm x 50mm chips?