Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-08D-41-C1-R0

  • AI
    The **ATS-08D-41-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is designed for cooling electronic components, specifically those in BGA (Ball Grid Array) packages. --- ## 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Product Series** | pushPIN™ Heat Sink | | **Attachment Method** | Push-Pin (Plastic) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 10.02°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 25.00mm | | **Pitch** | Fine Pitch | --- ## 2. Key Components and Design Features ### A. Push-Pin Mounting System This model uses a **push-pin** mechanism rather than adhesive or clips. * **Spring-loaded mechanism:** Provides consistent pressure for optimal thermal interface material (TIM) performance. * **Reliability:** Reduces the risk of the heat sink shifting during mechanical vibration or shipping. ### B. Fin Design * **Fine Pitch:** The "41" in the part number indicates a specific fin pattern designed for maximum surface area. * **Airflow Optimization:** These fins are engineered to dissipate heat effectively in both natural convection and forced-air (fan) environments. ### C. Thermal Interface Material (TIM) * **Pre-applied:** Usually comes with a high-performance thermal interface material (like T766) pre-applied to the base to simplify assembly and ensure uniform heat transfer from the chip to the aluminum. --- ## 3. Application Use Cases The ATS-08D-41-C1-R0 is typically used for the following electronic parts: 1. **CPUs and GPUs:** In embedded systems or industrial PCs. 2. **FPGAs/ASICs:** In networking gear or high-speed data processing units. 3. **Power Electronics:** Components that generate significant heat within a 40mm x 40mm footprint. --- ## 4. Part Number Breakdown ```text ATS - 08 D - 41 - C1 - R0 | | | | | | | | | +-- Revision Code | | | +------- Color/Finish (Blue Anodized) | | +------------ Fin Pattern/Height Code | +------------------ Mechanical Attachment Type +------------------------ Manufacturer (Advanced Thermal Solutions) ```
    ✨ Follow-up Questions
    • ⤷ What is the hole pattern requirement for mounting this heat sink?
    • ⤷ How does the thermal resistance change at 400 LFM airflow?
    • ⤷ Is there a version of this heat sink for larger 50mm x 50mm chips?