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  • ATS-08D-41-C3-R0

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    The **ATS-08D-41-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ## 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 30.00mm | | **Thermal Resistance** | 10.07°C/W (undirected airflow) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Fin Style** | Straight-Fin (High flow design) | --- ## 2. Key Design Elements ### A. pushPIN™ Attachment System Unlike adhesive-based heat sinks, this model uses a mechanical **pushPIN™** system. This provides: * **Constant Pressure:** Ensures a tight interface between the heat sink and the component for optimal heat transfer. * **Secure Mounting:** Resistant to vibration and shock, making it suitable for industrial or mobile electronics. * **Ease of Install:** Uses pre-assembled springs and pins that lock into standard PCB holes. ### B. "C3" Thermal Interface Material (TIM) The "C3" designation indicates that the heat sink comes with a **pre-applied thermal interface material**. This eliminates the need for manual thermal paste application, ensuring a uniform layer that reduces thermal resistance between the component and the aluminum base. ### C. Straight-Fin Geometry The fins are oriented in a straight pattern to maximize surface area while minimizing pressure drop. This is ideal for systems with a defined airflow direction (e.g., server racks or desktop cases). --- ## 3. Usage Context This heat sink is typically used in the following applications: 1. **Telecommunications:** For cooling high-speed networking chips. 2. **Power Electronics:** For MOSFETs or power modules. 3. **Embedded Systems:** For industrial PC components that require long-term reliability. --- ## 4. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Manufacturer) | | **08** | Series Identifier | | **D** | Attachment Type (pushPIN) | | **41** | Size/Package Code | | **C3** | Thermal Interface Material (TIM) Type | | **R0** | RoHS Compliant / Revision code |
    ✨ Follow-up Questions
    • ⤷ What are the specific hole dimensions required on a PCB for the pushPIN system?
    • ⤷ How does the thermal resistance change under different airflow conditions (LFM)?
    • ⤷ Is there a version of this heat sink available without pre-applied thermal material?