ATS-08D-41-C3-R0
AI

The **ATS-08D-41-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors.
---
## 1. Technical Specifications
The part number follows a specific nomenclature that defines its physical and thermal characteristics.
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 30.00mm |
| **Thermal Resistance** | 10.07°C/W (undirected airflow) |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Fin Style** | Straight-Fin (High flow design) |
---
## 2. Key Design Elements
### A. pushPIN™ Attachment System
Unlike adhesive-based heat sinks, this model uses a mechanical **pushPIN™** system. This provides:
* **Constant Pressure:** Ensures a tight interface between the heat sink and the component for optimal heat transfer.
* **Secure Mounting:** Resistant to vibration and shock, making it suitable for industrial or mobile electronics.
* **Ease of Install:** Uses pre-assembled springs and pins that lock into standard PCB holes.
### B. "C3" Thermal Interface Material (TIM)
The "C3" designation indicates that the heat sink comes with a **pre-applied thermal interface material**. This eliminates the need for manual thermal paste application, ensuring a uniform layer that reduces thermal resistance between the component and the aluminum base.
### C. Straight-Fin Geometry
The fins are oriented in a straight pattern to maximize surface area while minimizing pressure drop. This is ideal for systems with a defined airflow direction (e.g., server racks or desktop cases).
---
## 3. Usage Context
This heat sink is typically used in the following applications:
1. **Telecommunications:** For cooling high-speed networking chips.
2. **Power Electronics:** For MOSFETs or power modules.
3. **Embedded Systems:** For industrial PC components that require long-term reliability.
---
## 4. Part Number Breakdown
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Advanced Thermal Solutions (Manufacturer) |
| **08** | Series Identifier |
| **D** | Attachment Type (pushPIN) |
| **41** | Size/Package Code |
| **C3** | Thermal Interface Material (TIM) Type |
| **R0** | RoHS Compliant / Revision code |
- ⤷
What are the specific hole dimensions required on a PCB for the pushPIN system?
- ⤷ How does the thermal resistance change under different airflow conditions (LFM)?
- ⤷ Is there a version of this heat sink available without pre-applied thermal material?