The **ATS-08D-45-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### ## Technical Specifications The following table summarizes the key physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance (Flowing)** | 2.50°C/W @ 100 LFM | | **Thermal Resistance (Static)** | 15.14°C/W (Natural Convection) | | **Dimensions** | 25mm x 25mm x 15mm | | **Fin Style** | Straight (Fine Pitch) | --- ### ## Component Breakdown ### 1. The Fin Design (Cross-Cut) The ATS-08D-45-C3-R0 features a **fine-pitch fin design**. This maximizes the surface area available for heat transfer within a small footprint (25mm x 25mm). The straight fins are optimized for forced-air cooling (fan-driven systems). ### 2. pushPIN™ Attachment Mechanism Unlike adhesive-based heat sinks, this model uses a **push-pin and spring system**: * **Reliability:** Provides consistent pressure (clamping force) on the electronic component. * **Installation:** Requires pre-drilled holes on the PCB (typically 3.0mm diameter). * **Spring Type:** Usually stainless steel or brass for durability. ### 3. Thermal Interface Material (TIM) The "R0" suffix generally indicates that the part comes with **pre-applied Thermal Interface Material**. This is a high-performance thermal pad or grease located on the base of the heat sink, ensuring there are no air gaps between the heat sink and the chip it is cooling. ### 4. Material and Finish * **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodized Finish:** Not only provides a professional aesthetic but also adds a layer of corrosion resistance and slightly improves radiative heat transfer. --- ### ## Typical Applications * **Embedded Systems:** Cooling small-form-factor processors. * **Telecommunications:** Cooling ASICs in networking switches or routers. * **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators.