The **ATS-08D-47-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **blueICE™** series and is designed for cooling electronic components such as CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-08D-47-C3-R0 | | **Type** | Board Level Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 22.58°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 25.00mm x 25.00mm x 30.00mm | --- ### 2. Key Electronic Features #### A. Fin Design (Straight Fin) The device uses a straight-fin geometry. This is ideal for applications where the airflow is predictable and directional. The high aspect ratio of the fins maximizes the surface area for heat dissipation relative to the small 25mm footprint. #### B. pushPIN™ Attachment Unlike adhesive tapes which can degrade over time, this part uses a mechanical **pushPIN™** system. * **Engagement:** It uses a brass or plastic pin with a high-performance compression spring. * **Reliability:** Ensures a precise, constant pressure on the electronic component, which optimizes the interface between the heat sink and the chip. #### C. Thermal Interface Material (TIM) The "C3" designation typically indicates that the heat sink comes pre-applied with **ATS-PPS-08** or a similar Phase Change Material (PCM) or high-performance thermal grease. This eliminates the need for manual application and ensures low thermal resistance at the contact point. --- ### 3. Applications in Electronics This specific size and thermal profile are commonly found in: * **Networking Hardware:** Routers, switches, and high-speed modems. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling MOSFETs or voltage regulators. --- ### 4. Thermal Performance Overview The efficiency of this part depends heavily on the Air Velocity (LFM - Linear Feet per Minute): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 22.58 | | 300 (1.5 m/s) | 12.00 | | 500 (2.5 m/s) | 9.00 |