The part number **ATS-08D-49-C3-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "blue" anodized push-pin heat sink series, designed specifically for cooling electronic components like BGA (Ball Grid Array) chips, FPGAs, and processors. --- ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Series** | pushPIN™ Heat Sink Assembly | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Thermal Resistance** | 2.70°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 25mm x 25mm x 20mm | | **TIM (Interface Material)** | T412 (High performance) | --- ### 2. Physical Design Features The heat sink is designed with a **fine-pitch fin pattern** to maximize surface area within a small footprint. * **Fins:** These are vertical extrusions that dissipate heat into the surrounding air. The "49" in the part number indicates a specific fin configuration optimized for medium-to-high airflow. * **Push-Pins:** These provide a secure mechanical attachment to the PCB. They are spring-loaded to ensure constant pressure (Force) between the heat sink and the component, which is critical for efficient heat transfer. * **Thermal Interface Material (TIM):** This model comes pre-applied with **T412**, which fills microscopic air gaps between the chip and the heat sink, significantly reducing thermal resistance. --- ### 3. Thermal Performance Comparison Thermal performance varies based on the airflow (measured in Linear Feet per Minute - LFM). | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Unducted) | 6.00 | | 200 (Unducted) | 2.70 | | 300 (Unducted) | 2.20 | | 400 (Unducted) | 1.90 | --- ### 4. Application Use-Cases * **Telecommunications:** Cooling high-speed network switches. * **Industrial PC:** Thermal management for compact embedded systems. * **Consumer Electronics:** Providing passive or active cooling for video processors.