The **ATS-08D-52-C3-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from electronic integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table breaks down the mechanical and thermal properties of this specific part number: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Fin Type** | Straight Fin | | **Thermal Resistance** | 10.80°C/W (at 1.0 m/s airflow) | | **Dimensions (L x W x H)** | 35.0mm x 35.0mm x 25.0mm | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Electronic & Mechanical Components #### A. The Heat Sink Body Constructed from high-grade aluminum, the body features a **straight-fin design**. Straight fins are optimized for systems with a consistent direction of airflow (longitudinal flow), allowing air to pass through the channels and carry away heat efficiently. #### B. Push-Pin Attachment Mechanism Instead of using adhesive tape or screws, this part uses a **Brass Push-Pin** system with a compression spring. * **Reliability:** Provides consistent pressure on the electronic component, ensuring maximum contact. * **Security:** Prevents the heat sink from shifting during high-vibration environments (common in industrial or automotive electronics). #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. * **Purpose:** It fills the microscopic air gaps between the heat sink and the electronic chip. * **Benefit:** Since air is a poor conductor, the T766 paste/pad significantly lowers the thermal resistance, allowing for faster heat transfer. --- ### 3. Part Number Deciphering Understanding the ATS nomenclature helps in identifying its electronic fit: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **08D:** Series designation (typically refers to specific fin patterns/attachments). * **52:** Dimensions code (35mm x 35mm). * **C3:** Performance/Material grade. * **R0:** Revision code (Standard version). --- ### 4. Ideal Applications This component is typically found in: 1. **Telecommunications:** Cooling high-speed network processors. 2. **Embedded Systems:** Managing thermals in industrial motherboards. 3. **Power Supplies:** Heat dissipation for MOSFETs or power ICs.