The **ATS-08D-54-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the *pushPIN™* series, designed for precision cooling of electronic components like CPUs, GPUs, or power transistors. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Series** | pushPIN™ | | **Heat Sink Type** | Fine-Pitch (Straight Fin) | | **Material** | Aluminum (Blue Anodized) | | **Thermal Resistance** | 7.00°C/W (at 100 LFM) | | **Attachment Method** | Push-Pin (Brass) | | **Dimensions** | 35.00mm x 35.00mm x 25.00mm | | **Spring Type** | ATS-PPS-08 | --- ### 2. Key Component Details #### A. Thermal Interface Material (TIM) This part typically comes pre-applied with **T766** thermal interface material. This is a high-performance phase-change material or grease that fills microscopic air gaps between the heat source and the heat sink base, ensuring maximum heat transfer. #### B. Attachment Mechanism (Push-Pins) The "08" in the part number refers to the specific push-pin and spring combination. * **Brass Push-Pins:** These provide a secure, vibration-resistant mechanical connection to the PCB. * **Compression Springs:** These apply a specific amount of downward force (pressure) to optimize the thermal contact without damaging the semiconductor or the circuit board. #### C. Fin Design The heat sink features a **Fine-Pitch** design. This means it has a high density of thin fins, which maximizes the surface area for heat dissipation. This design is most effective in systems with forced air cooling (fans). --- ### 3. Part Number Breakdown ```text ATS - 08 D - 54 - C2 - R0 | | | | | | | | | | | +-- Revision/Color Code (R0 = Blue Anodized) | | | | +------- Thermal Interface Material (C2 = T766) | | | +------------ Height (54 = 25mm in this series chart) | | +----------------- Attachment Type (D = Push-Pin) | +------------------- Spring/Pin Kit Type (08) +------------------------- Manufacturer (Advanced Thermal Solutions) ``` --- ### 4. Application Use Cases * **Embedded Systems:** Cooling microprocessors in industrial controllers. * **Telecommunications:** Managing heat in high-speed networking switches. * **Power Electronics:** Dissipating heat from MOSFETs or Voltage Regulators.