ATS-08D-55-C3-R0
AI

The **ATS-08D-55-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series and is designed for efficient cooling of integrated circuits (ICs) and other heat-generating components on a PCB.
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### 1. Technical Specifications
The following table highlights the core physical and thermal properties of the device:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Type** | pushPIN™ |
| **Thermal Resistance** | 24.11 °C/W (Unducted Flow @ 100 LFM) |
| **Dimensions (L x W)** | 35.00 mm x 35.00 mm |
| **Height** | 10.00 mm |
| **Pitch** | Fine-Pitch |
| **Pattern** | XC (Cross-Cut) |
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### 2. Key Components & Features
#### A. Cross-Cut (XC) Fin Design
The "XC" designation refers to the cross-cut fin pattern. Unlike straight fins, cross-cut fins allow for **multi-directional airflow**. This is critical in compact electronic enclosures where air may not flow in a single, predictable path.
#### B. pushPIN™ Attachment Mechanism
This part utilizes a specialized spring-loaded attachment system:
* **Compression Springs:** Ensure consistent pressure (Force) between the heat sink and the component, maximizing thermal transfer.
* **Plastic/Brass Push Pins:** Designed to snap into pre-drilled holes in the PCB, reducing installation time and mechanical stress.
#### C. Thermal Interface Material (TIM)
The part typically comes with **T412** thermal tape or a pre-applied phase-change material. This fills the microscopic air gaps between the heat source (e.g., a CPU or FPGA) and the aluminum base to improve heat conductivity.
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### 3. Thermal Performance Metrics
Thermal resistance varies based on the Air Velocity (measured in Linear Feet per Minute - LFM):
| Air Velocity (LFM) | 100 | 300 | 500 | 700 |
| :--- | :--- | :--- | :--- | :--- |
| **Resistance (°C/W)** | 24.11 | 6.97 | 4.07 | 3.03 |
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### 4. Part Number Breakdown
* **ATS:** Advanced Thermal Solutions (Manufacturer)
* **08:** Series/Attachment Type
* **D:** Spring Type
* **55:** Product Number
* **C3:** Finish / Color (Blue Anodized)
* **R0:** RoHS Compliance / Revision
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- ⤷
What are the PCB hole diameter requirements for the pushPIN attachment?
- ⤷ How does the Blue Anodized finish affect the thermal emissivity of the heat sink?
- ⤷ Is this heat sink suitable for high-vibration environments?