The **ATS-08D-73-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" family, designed for cooling integrated circuits (ICs) and other electronic components. --- ### Technical Specifications The following table summarizes the key physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Fin Type** | Fine-Pitch | | **Pattern** | Straight Fin | | **Dimensions (L x W)** | 45.00 mm x 45.00 mm | | **Height (H)** | 20.00 mm | | **Pitch** | 1.14 mm | | **Thermal Resistance** | 1.50 °C/W (@ 1.0 m/s) | --- ### Component Breakdown #### 1. Heat Sink Body The body is made of **AL6063 aluminum**, which offers a high thermal conductivity-to-weight ratio. The "Fine-Pitch" design increases the surface area significantly, allowing for better heat dissipation into the surrounding air via convection. #### 2. Attachment Mechanism (pushPIN™) Unlike adhesive-based heat sinks, this model uses a mechanical mounting system: * **Pins:** Usually made of brass or plastic to secure the sink to the PCB. * **Springs:** Provide constant pressure (Pre-assembled) to ensure optimal contact between the heat sink and the component. * **Hole Pattern:** Requires specific pre-drilled holes on the PCB (typically 38.00 mm pitch for this series). #### 3. Thermal Interface Material (TIM) The "C3" in the part number typically indicates that the heat sink comes with a **Phase Change Material (PCM)** or high-performance thermal pad pre-applied to the base. This fills microscopic air gaps between the heat sink and the chip to reduce thermal resistance. --- ### Thermal Performance Data The efficiency of the ATS-08D-73-C3-R0 depends heavily on the airflow (velocity) within the electronic enclosure: | Air Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | | 0.5 (Unducted) | 14.71 | | 1.0 (Unducted) | 5.42 | | 2.0 (Unducted) | 3.12 | | 5.0 (Unducted) | 1.50 | --- ### Common Applications * **FPGA/ASIC Cooling:** High-speed processors that generate significant localized heat. * **Networking Gear:** Switches and routers where consistent airflow is available. * **Power Supplies:** Cooling voltage regulators or power transistors.