The **ATS-08D-76-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS. Below are the primary specifications: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 11.84°C/W (at 200 LFM) | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 25.0mm x 25.0mm x 10.0mm | | **Fin Type** | Fine Pitch (Straight Fin) | --- ### 2. Key Components & Design Features #### A. The pushPIN™ Attachment System One of the defining features of this part is the **pushPIN™** mechanism. This is a mounting kit that consists of: * **Plastic/Brass Pins:** Secure the heat sink to the PCB through pre-drilled holes. * **Compression Springs:** Provide precise pressure (force) to ensure a solid contact between the heat sink base and the electronic component. #### B. Material and Coating * **Aluminum:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodized Finish:** This is not just for aesthetics; the anodized layer provides increased surface emissivity (improving radiation heat transfer) and protects the aluminum from corrosion. #### C. Thermal Interface Material (TIM) The "R0" at the end of the part number typically signifies the pre-applied thermal material. * **Phase Change Material:** It usually comes with a high-performance T766 thermal pad or grease pre-applied to the base, ensuring no air gaps exist between the heat source and the sink. --- ### 3. Application Use Cases This specific heat sink is categorized as a "Small Form Factor" cooling solution. Common applications include: 1. **Telecommunications:** Cooling small chips in routers or switches. 2. **Embedded Systems:** Industrial PCs where space is limited. 3. **Power Supplies:** Cooling voltage regulators or MOSFETs. --- ### 4. Thermal Performance Comparison The effectiveness of this part depends heavily on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Unducted) | 27.50 | | 200 (Unducted) | 11.84 | | 400 (Unducted) | 7.32 |