The **ATS-08D-77-C3-R0** is a specific part number for a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push-pin" series designed for cooling electronic components like CPUs, GPUs, or high-power chipsets. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Attachment Type** | Push-Pin (Plastic/Brass) | | **Fin Style** | Straight Fin | | **Dimensions (L x W x H)** | 25mm x 25mm x 20mm | | **Thermal Resistance (Flow)** | 9.58°C/W @ 100 LFM (Linear Feet per Minute) | | **Thermal Interface Material** | T412 (Phase Change Material) | --- ### 2. Physical Characteristics The part is designed for compact spaces where vertical airflow is available. Its construction details are key to its efficiency: * **Fin Pitch:** Optimized for "Active" cooling environments (where a fan is present). * **Base:** A flat, precision-machined surface to ensure maximum contact with the electronic component's die. * **Blue Anodization:** Not only provides a professional look but also increases the surface emissivity slightly and prevents oxidation. --- ### 3. Mounting System: Push-Pin & Spring Unlike adhesive-based heatsinks, the `ATS-08D-77-C3-R0` uses a mechanical mounting system: 1. **Push-Pin:** Allows for secure attachment to a PCB via pre-drilled holes. 2. **Springs:** Provides consistent, high pressure on the component. This ensures the **Thermal Interface Material (TIM)** spreads evenly and fills microscopic air gaps. 3. **T412 Interface:** This is a high-performance "Phase Change" material pre-applied to the bottom. It softens at operating temperatures to create a low-resistance thermal bond. --- ### 4. Thermal Performance Comparison The performance of this heatsink depends heavily on the airflow (LFM) within the electronic enclosure: | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100** | 9.58 | | **200** | 6.07 | | **300** | 5.33 | | **400** | 4.91 | --- ### 5. Common Use Cases * **Network Switches/Routers:** Cooling small ASICs or processors. * **Embedded Computing:** Industrial PC modules (COM Express, etc.). * **Power Supplies:** Heat dissipation for MOSFETs or Voltage Regulators.