The **ATS-08D-79-C3-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic packages. It is part of the "pushPIN™" series manufactured by Advanced Thermal Solutions (ATS). --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Fin Type** | Straight Fin | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimension (Length/Width)** | 25.00 mm x 25.00 mm | | **Height (Off Base)** | 30.00 mm | | **Thermal Resistance (Unducted)** | 2.68 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 1.20 °C/W @ 100 LFM | | **Finish** | Blue Anodized | --- ### 2. Electronic Application & Function In an electronic circuit, the ATS-08D-79-C3-R0 serves as a **passive heat exchanger**. Its primary roles include: * **Thermal Dissipation:** It increases the surface area of a heat-generating component (like a CPU, FPGA, or MOSFET), allowing the heat to be transferred into the surrounding air more efficiently. * **Thermal Interface:** It is designed to be used with a **Thermal Interface Material (TIM)**, such as thermal grease or a pad, to bridge the microscopic air gaps between the component and the heatsink base. * **Mechanical Stability:** The "pushPIN™" system uses a flexible attachment mechanism that provides consistent pressure across the component, ensuring reliable thermal contact while allowing for thermal expansion. --- ### 3. Part Number Breakdown The part number can be decoded to understand its specific configuration: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **08D** | Series/Specific Design Profile | | **79** | Specific dimension/geometry code | | **C3** | Thermal Performance/Material Grade | | **R0** | RoHS Compliant / Revision code | --- ### 4. Implementation Considerations When integrating this part into an electronic design, engineers must consider: 1. **Airflow Direction:** Straight fin heatsinks are directional; maximum efficiency is achieved when airflow is parallel to the fins. 2. **Keep-out Zones:** The pushPIN™ attachment requires specific hole patterns on the PCB around the electronic component. 3. **Component Height:** At 30mm height, this is a relatively tall heatsink for its small 25x25mm footprint, making it suitable for compact enclosures with vertical space.