ATS-08D-85-C3-R0
AI

The **ATS-08D-85-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for efficient heat dissipation on Printed Circuit Boards (PCBs).
### 1. Technical Specifications
Below are the primary physical and thermal characteristics of the part:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 30.00mm |
| **Fin Type** | Fine Pitch (Square Pattern) |
| **Thermal Resistance** | 22.98 °C/W (at 100 LFM) |
| **Thermal Interface Material (TIM)** | T412 (Pre-applied) |
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### 2. Design Components
This part is more than just a block of metal; it is a system of electronic cooling components:
* **The Heat Sink Body:** A 30mm cube with a "Fine Pitch" design. This increases the surface area significantly, allowing air to pass through and carry heat away from the processor or power component.
* **The pushPIN™ Mechanism:** This replaces traditional adhesive or screw mounting. It uses a flexible attachment system that provides consistent pressure for better thermal contact.
* **The Compression Spring:** A stainless steel spring (part of the assembly) ensures that the heat sink maintains high contact pressure with the electronic chip even under vibration or thermal expansion.
* **T412 Thermal Interface Material:** This is a "Phase Change Material" pre-applied to the base. It fills the microscopic air gaps between the chip and the heat sink to maximize heat transfer efficiency.
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### 3. Application Use Cases
This specific part is typically found in:
1. **Telecommunications:** Cooling high-speed signal processors.
2. **Embedded Systems:** For industrial computers where space is constrained but vertical clearance is available.
3. **Power Electronics:** Managing heat for Voltage Regulator Modules (VRMs).
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### 4. Thermal Performance Comparison
The performance varies based on the Air Flow (measured in Linear Feet per Minute - LFM):
| Air Flow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) |
| :--- | :--- | :--- |
| 100 | 0.5 | 22.98 |
| 200 | 1.0 | 10.22 |
| 400 | 2.0 | 5.33 |
| 600 | 3.0 | 4.05 |
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What are the advantages of using a pushPIN attachment over traditional thermal adhesive?
- ⤷ How does the 'Blue Anodized' finish affect the heat sink's performance?
- ⤷ Is the T412 thermal interface material suitable for high-vibration environments?