ATS-08D-86-C3-R0
AI

The **ATS-08D-86-C3-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors.
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### 1. Technical Specifications
The following table outlines the mechanical and thermal characteristics of this specific part:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. |
| **Series** | pushPIN™ |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Dimensions (L x W)** | 35mm x 35mm |
| **Height** | 15mm |
| **Attachment Method** | Push-Pin (Plastic/Brass) |
| **Thermal Resistance** | 8.90°C/W (at 100 LFM) |
| **Fin Type** | Fine Pitch (Straight Fin) |
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### 2. Key Electronic Features
#### A. Thermal Management
The primary electronic function is to lower the junction temperature ($T_j$) of a semiconductor. By increasing the surface area for convection, it prevents **thermal throttling** or permanent damage to the integrated circuit (IC).
#### B. Mounting System (Push-Pins)
Unlike adhesive-based heat sinks, the **ATS-08D-86-C3-R0** uses a mechanical push-pin system. This is critical for electronics that experience high vibration or require precise mechanical tension:
* **Compression Springs:** Provide uniform pressure across the thermal interface material (TIM).
* **Pre-drilled Holes:** Requires a PCB with specific mounting hole patterns (typically 29mm - 31mm spacing).
#### C. Material Properties
* **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties.
* **Blue Anodized Coating:** Provides electrical insulation and corrosion resistance, ensuring that if the heat sink accidentally touches a nearby trace, it is less likely to cause a short circuit (though the bottom surface is usually bare or covered in TIM).
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### 3. Usage Context
This part is typically found in:
* **Networking Equipment:** Routers and switches with high-speed processors.
* **Industrial PCs:** Compact systems where airflow is limited.
* **Power Supplies:** Cooling voltage regulators or MOSFETs.
- ⤷
What is the recommended hole pattern for mounting the ATS-08D-86-C3-R0?
- ⤷ How does the thermal resistance of this heat sink change as airflow (LFM) increases?
- ⤷ Which thermal interface materials (TIM) are best suited for this heat sink?