The **ATS-08D-91-C1-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Push-Pin Heat Sink**. It is designed to cool electronic components like CPUs, GPUs, or FPGAs by dissipating heat into the surrounding air. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Type** | Push-Pin (Plastic/Brass) | | **Fin Style** | Straight Fin | | **Dimensions** | 40mm x 40mm x 10mm | | **Thermal Resistance** | 21.86°C/W (at 100 LFM) | | **Flow Pattern** | Vertical/Side Flow | --- ### 2. Electronic Component Breakdown #### A. The Heat Sink Body The core component is made of **Aluminum 6063**. Aluminum is chosen for electronic cooling because it offers a high thermal conductivity-to-weight ratio. The "Straight Fin" design allows for maximum surface area exposure to airflow, which is critical for convective heat transfer. #### B. The Interface (TIM) The part number suffix typically indicates the inclusion of a **Thermal Interface Material (TIM)**. For this model, it usually comes with **T766**, a high-performance phase-change material or thermal tape. This fills the microscopic air gaps between the electronic chip (heat source) and the bottom of the heat sink to ensure efficient heat conduction. #### C. The Mechanical Attachment The "Push-Pin" system consists of: * **Compression Spring:** Maintains consistent downward pressure on the electronic component to ensure the TIM stays in contact. * **Pin:** Inserts into pre-drilled holes on the PCB (Printed Circuit Board) to lock the heat sink in place without needing tools. --- ### 3. Thermal Performance Metrics In electronics, performance varies based on the velocity of the air (measured in Linear Feet per Minute - LFM). | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 21.86 | | 300 | 1.5 | 7.40 | | 500 | 2.5 | 5.30 | --- ### 4. Implementation Example If you are designing a PCB with a high-heat IC, you would integrate this part into your CAD/EDA software using the following footprint considerations: ```markdown - Component Hole Diameter: 3.0mm - Hole-to-Hole Distance: 33mm (Diagonal/Center-to-Center) - Stay-out Zone: 45mm x 45mm (to allow for pin clearance) ```