The **ATS-08E-06-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It is part of the "push pin" attachment series designed for cooling components like CPUs, GPUs, and other high-heat integrated circuits. ### 1. Technical Specifications Table | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-08E-06-C2-R0 | | **Base Series** | superGRIP™ / Push-Pin | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 20.12° C/W @ 100 LFM (Linear Feet per Minute) | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 10.00mm | --- ### 2. Core Components & Design Features #### A. Fin Profile (Fine-Pitch Design) The "08E" designation refers to a specific fin pattern. These heat sinks utilize a **cross-cut** or **straight fin** geometry designed to maximize surface area within a small footprint. This allows for better heat dissipation via convection. #### B. Push-Pin Attachment Instead of using messy thermal adhesives or complex screws, this part uses a **spring-loaded push-pin** mechanism. * **The Pin:** Usually made of plastic or brass. * **The Spring:** Provides consistent downward pressure (interface pressure) to ensure the heat sink stays in contact with the electronic chip, optimizing thermal transfer. #### C. Material and Coating * **Aluminum 6063:** Lightweight with excellent thermal conductivity. * **Blue Anodized Finish:** This is not just for aesthetics; anodizing increases the surface emissivity, slightly improving radiant heat transfer and providing corrosion resistance. --- ### 3. Thermal Performance Indicators The efficiency of this part is measured by its thermal resistance (lower is better). Its performance varies based on the airflow (LFM) provided by system fans: | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural/Low) | 20.12 | | 300 (Moderate) | 8.24 | | 500 (High) | 5.53 | --- ### 4. Applications This part is commonly found in: * **Telecommunications:** Cooling high-speed processing chips. * **Embedded Systems:** Industrial PCs where space is limited. * **Network Hardware:** Routers and switches that require reliable, long-term cooling without mechanical failure. ---