The **ATS-08E-08-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for efficient cooling of semiconductors and electronic components. ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 45mm x 45mm x 15mm | | **Fin Style** | Fine Pitch (Straight) | | **Thermal Resistance** | 14.59°C/W (at 100 LFM) | | **Spring Type** | ATS-PP-05 | --- ### 2. Key Electronic Features The "C2" and "R0" designations in the part number refer to specific material and compliance standards critical for modern electronics: * **Thermal Interface Material (TIM):** The **C2** suffix indicates that the part comes pre-applied with **T766** thermal phase change material. This ensures maximum heat transfer between the electronic chip (CPU, FPGA, etc.) and the aluminum sink. * **RoHS Compliance:** The **R0** suffix confirms the part is Lead-free and meets RoHS (Restriction of Hazardous Substances) standards, making it suitable for global manufacturing. * **Attachment Force:** The pushPIN™ system utilizes a compression spring to provide a specific "pre-load" force, ensuring consistent contact with the electronic component without damaging delicate solder balls (BGA). --- ### 3. Application Use Cases This specific heat sink is typically used in the following electronic environments: 1. **Telecommunications:** Cooling of high-speed network switches and routers. 2. **Embedded Computing:** Thermal management for System-on-Chips (SoCs) and FPGAs. 3. **Power Supplies:** Heat dissipation for MOSFETs and power regulators. --- ### 4. Thermal Performance Comparison Thermal resistance decreases as airflow (measured in Linear Feet per Minute - LFM) increases: | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 14.59 | | 300 (1.5 m/s) | 4.80 | | 500 (2.5 m/s) | 3.11 |