The **ATS-08E-101-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for cooling components on printed circuit boards (PCBs). --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Plastic/Brass) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 30mm | | **Thermal Resistance** | 6.70°C/W (at 200 LFM) | | **Flow Orientation** | Vertical / Omni-directional (High-Performance Fin design) | --- ### 2. Electronic Application & Usage This part is not an "electronic component" in the sense of a transistor or IC, but rather a **passive cooling solution** essential for the reliability of electronic systems. #### Key Functions: * **Heat Dissipation:** It increases the surface area of high-heat components (like CPUs, FPGAs, or Power MOSFETs), allowing air to carry heat away more efficiently. * **Thermal Protection:** Prevents thermal throttling or permanent damage to semiconductors by maintaining a safe junction temperature. * **EMI Shielding:** In some specific layouts, the metal mass can provide minor incidental electromagnetic interference (EMI) reduction, though this is not its primary purpose. --- ### 3. Component Breakdown The part number follows a specific nomenclature used by Advanced Thermal Solutions: 1. **ATS-08**: The series identifier (Push-Pin Heat Sink series). 2. **E**: Denotes the mounting hole pattern/spacing. 3. **101**: The specific fin configuration and geometry. 4. **C3**: Indicates the **Thermal Interface Material (TIM)** and finish. In this case, it usually refers to a Blue Anodized finish with a specific pre-applied thermal pad or grease. 5. **R0**: Revision or packaging code. --- ### 4. Installation Design The "Push Pin" system consists of: * **The Pin:** A plastic or brass plunger. * **The Spring:** Provides constant downward pressure to ensure the thermal interface material makes perfect contact with the electronic chip. * **Hole Pattern:** Requires pre-drilled holes in the PCB at a specific distance (calculated based on the 'E' designator).