The **ATS-08E-124-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** from the *pushPIN™* series manufactured by Advanced Thermal Solutions (ATS). Below is a breakdown of its technical specifications and electronic application characteristics. ### 1. Technical Specifications The part is designed for cooling electronic components like CPUs, GPUs, or high-power transistors. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-08E-124-C2-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Fin Type** | Fine Pitch (Straight Fin) | | **Dimensions** | 50.00mm x 50.00mm x 25.00mm | | **Thermal Resistance** | 3.18°C/W (at 100 LFM) | --- ### 2. Design and Component Breakdown #### A. The Heat Sink Body The body is made of **AL6063 aluminum**, which is preferred in electronics for its high thermal conductivity and lightweight properties. The **Blue Anodized** coating is not just for aesthetics; it increases surface emissivity and provides corrosion resistance. #### B. The pushPIN™ Attachment System Instead of using messy thermal adhesives or simple clips, this part uses a **pushPIN™** system: * **Brass Components:** The pins are typically made of brass or plastic. * **Compression Springs:** These ensure "Precise Force Control," providing a specific amount of pressure (PSI) to the electronic chip to maximize heat transfer without cracking the silicon die. #### C. Thermal Interface Material (TIM) The "R0" at the end of the part number usually signifies that the part comes with **T766 thermal interface material** pre-applied. This is a "phase change" or high-performance pad that fills microscopic air gaps between the component and the heat sink. --- ### 3. Thermal Performance Data Performance varies based on the airflow (Linear Feet per Minute) within the electronic enclosure: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 3.18 | | 300 (1.5 m/s) | 1.81 | | 500 (2.5 m/s) | 1.48 | | 700 (3.5 m/s) | 1.30 | --- ### 4. Implementation Code (CAD Integration) Engineers often use specific dimensions for PCB layout. Here is a representation of the mounting hole requirement: ```yaml PCB_Layout_Requirements: Hole_Diameter: 3.175mm (0.125 in) Hole_Spacing_X: 43.00mm Hole_Spacing_Y: 43.00mm Component_Height_Clearance: 25.00mm ```