ATS-08E-13-C2-R0
AI

The **ATS-08E-13-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions, Inc. (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure.
### 1. Technical Specifications
Below are the primary physical and thermal characteristics of this specific model:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W x H)** | 50.00mm x 50.00mm x 15.00mm |
| **Thermal Resistance (Flowing Air)** | 1.37°C/W @ 200 LFM |
| **Fin Type** | Fine Pitch (Rectangular) |
| **Thermal Interface Material** | T766 (Pre-applied) |
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### 2. Key Component Breakdown
#### A. The pushPIN™ Attachment System
Unlike adhesive-based heat sinks, the "R0" series uses a mechanical **pushPIN™** system. This consists of:
* **Compression Springs:** Provide precise vertical pressure to ensure optimal contact with the semiconductor surface.
* **Plastic or Brass Pins:** Secure the heat sink through pre-drilled holes in the Printed Circuit Board (PCB).
#### B. Thermal Interface Material (TIM)
The unit comes with **T766** pre-applied to the base. This is a "Phase Change" or high-conductivity material that fills microscopic air gaps between the component and the heat sink, significantly reducing thermal resistance.
#### C. Fin Design and Airflow
The "Fine Pitch" geometry is optimized for forced-air cooling (fans). The 15mm height provides a balance between surface area for heat dissipation and low-profile clearance for compact electronic enclosures.
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### 3. Part Number Decoding
The part number follows a specific nomenclature used by Advanced Thermal Solutions:
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer (Advanced Thermal Solutions) |
| **08** | Series/Product Family (pushPIN™) |
| **E** | Attachment Style |
| **13** | Specific model/size code |
| **C2** | Material/Finish (Aluminum / Blue Anodized) |
| **R0** | Revision or Packaging code |
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### 4. Applications
* **Networking Equipment:** High-speed routers and switches.
* **Embedded Systems:** Industrial PCs and controllers.
* **Power Supplies:** Cooling MOSFETs and voltage regulators.
- ⤷
What are the PCB hole requirements for the pushPIN attachment system?
- ⤷ How does blue anodization affect the thermal performance compared to bare aluminum?
- ⤷ Can this heat sink be used in a passive (no-fan) cooling environment?