ATS-08E-142-C2-R0
AI

The **ATS-08E-142-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed to provide efficient cooling for electronic components like processors, GPUs, and power modules.
### 1. Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Part Number** | ATS-08E-142-C2-R0 |
| **Material** | Aluminum (Black Anodized) |
| **Attachment Method** | Push Pin (Plastic/Brass) |
| **Thermal Resistance** | 4.70°C/W (at 200 LFM) |
| **Fin Style** | Straight Fin |
| **Dimensions** | 30.00mm x 30.00mm x 15.00mm |
---
### 2. Component Composition
This part is composed of four primary electronic/mechanical sub-elements:
1. **The Heat Sink Body:** Made of extruded aluminum, which is favored for its thermal conductivity-to-weight ratio. The **Black Anodized** finish isn't just for aesthetics; it increases emissivity, allowing for better heat radiation.
2. **The Fin Array:** It utilizes a high-aspect-ratio straight fin design. This is optimized for **forced air cooling** (where a fan is present) to maximize the surface area exposed to the airflow.
3. **The Push-Pin Mechanism:** This specific model uses a spring-loaded push-pin system. This ensures consistent "clip pressure" against the component, which is vital for thermal transfer efficiency.
4. **Thermal Interface Material (TIM):** The "C2" in the part number often indicates that the unit comes pre-applied with a **Phase Change Material** or thermal tape, specifically **Saint-Gobain T412**, which fills microscopic air gaps between the heat sink and the chip.
---
### 3. Application Use Cases
The ATS-08E-142-C2-R0 is typically found in the following electronic environments:
* **Telecommunications:** Cooling of high-speed ASICs in routers and switches.
* **Embedded Systems:** Industrial PCs where space is limited but heat generation is high.
* **Power Supplies:** Heat dissipation for MOSFETs or voltage regulators.
---
### 4. Thermal Performance Data
Performance varies based on the Air Velocity (measured in Linear Feet per Minute - LFM):
```json
{
"airflow_performance": {
"100_LFM": "7.20 °C/W",
"200_LFM": "4.70 °C/W",
"400_LFM": "3.30 °C/W",
"600_LFM": "2.80 °C/W"
}
}
```
- ⤷
What are the mounting hole requirements for the push-pin mechanism?
- ⤷ How does the T412 thermal interface material compare to standard thermal grease?
- ⤷ Can this heat sink be used in a passive cooling environment without a fan?