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  • ATS-08E-142-C2-R0

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    The **ATS-08E-142-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed to provide efficient cooling for electronic components like processors, GPUs, and power modules. ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-08E-142-C2-R0 | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | Push Pin (Plastic/Brass) | | **Thermal Resistance** | 4.70°C/W (at 200 LFM) | | **Fin Style** | Straight Fin | | **Dimensions** | 30.00mm x 30.00mm x 15.00mm | --- ### 2. Component Composition This part is composed of four primary electronic/mechanical sub-elements: 1. **The Heat Sink Body:** Made of extruded aluminum, which is favored for its thermal conductivity-to-weight ratio. The **Black Anodized** finish isn't just for aesthetics; it increases emissivity, allowing for better heat radiation. 2. **The Fin Array:** It utilizes a high-aspect-ratio straight fin design. This is optimized for **forced air cooling** (where a fan is present) to maximize the surface area exposed to the airflow. 3. **The Push-Pin Mechanism:** This specific model uses a spring-loaded push-pin system. This ensures consistent "clip pressure" against the component, which is vital for thermal transfer efficiency. 4. **Thermal Interface Material (TIM):** The "C2" in the part number often indicates that the unit comes pre-applied with a **Phase Change Material** or thermal tape, specifically **Saint-Gobain T412**, which fills microscopic air gaps between the heat sink and the chip. --- ### 3. Application Use Cases The ATS-08E-142-C2-R0 is typically found in the following electronic environments: * **Telecommunications:** Cooling of high-speed ASICs in routers and switches. * **Embedded Systems:** Industrial PCs where space is limited but heat generation is high. * **Power Supplies:** Heat dissipation for MOSFETs or voltage regulators. --- ### 4. Thermal Performance Data Performance varies based on the Air Velocity (measured in Linear Feet per Minute - LFM): ```json { "airflow_performance": { "100_LFM": "7.20 °C/W", "200_LFM": "4.70 °C/W", "400_LFM": "3.30 °C/W", "600_LFM": "2.80 °C/W" } } ```
    ✨ Follow-up Questions
    • ⤷ What are the mounting hole requirements for the push-pin mechanism?
    • ⤷ How does the T412 thermal interface material compare to standard thermal grease?
    • ⤷ Can this heat sink be used in a passive cooling environment without a fan?