The **ATS-08E-18-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. Below is a detailed breakdown of its specifications and electronic application characteristics. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Thermal Resistance** | 13.38°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 15.00mm | | **Fin Style** | Fine Pitch (Cross-Cut) | --- ### 2. Key Component Features #### A. Thermal Performance The "C2" in the part number indicates a specific thermal profile. The heatsink is designed to dissipate heat generated by chips (CPUs, GPUs, FPGAs) into the surrounding air. * **Low Flow (100 LFM):** 13.38°C/W * **High Flow (700 LFM):** 2.11°C/W As air velocity increases, the efficiency of the electronic cooling improves significantly. #### B. The pushPIN™ Attachment System This part uses a specific mechanical interface consisting of: * **Push-pins:** Usually made of brass or plastic. * **Compression Springs:** These provide precisely calculated "Force" (Pressure) to ensure maximum contact between the heatsink base and the electronic component. * **TIM (Thermal Interface Material):** Usually comes pre-applied with **T766**, a high-performance thermal grease to bridge the microscopic air gaps between the chip and the aluminum. #### C. Cross-Cut Fin Design Unlike straight-fin heatsinks, the ATS-08E features a cross-cut pattern. In electronics, this is beneficial because it allows for **omnidirectional airflow**, meaning the cooling efficiency is less dependent on the direction the fan is blowing. --- ### 3. Dimensional Analysis | Dimension | Measurement | | :--- | :--- | | **Length/Width** | 35.00 mm | | **Height** | 15.00 mm | | **Pitch** | Fine | --- ### 4. Application in Electronic Systems This part is commonly found in: * **Network Switches/Routers:** For cooling ASICs. * **Industrial PCs:** Where vibration resistance is required (the push-pin provides a more secure mechanical bond than adhesive tapes). * **Power Supplies:** To cool MOSFETs or voltage regulators.