The **ATS-08E-30-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications Below are the primary technical parameters for this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Thermal Resistance** | 5.31°C/W (at 100 LFM) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Dimensions (L x W x H)** | 70.00mm x 70.00mm x 25.00mm | | **Fin Style** | Straight Fin | --- ### 2. Physical Design & Construction * **Fin Type:** It features a **Straight Fin** design, which is optimized for high-performance airflow environments where the air moves in a linear direction through the fins. * **Material (Aluminum 6063):** Chosen for its excellent thermal conductivity and lightweight properties. * **Surface Treatment:** The "Blue Anodized" finish is not just for aesthetics; it provides corrosion resistance and increases surface emissivity, which slightly improves radiative heat transfer. --- ### 3. Attachment Mechanism: pushPIN™ The "R0" at the end of the part number typically signifies the specific mounting hardware included. This model uses the **pushPIN™** system: * **Pre-assembled:** It comes with a flexible, spring-loaded push-pin. * **Compression:** The spring ensures constant pressure on the thermal interface material (TIM) to maximize heat transfer between the chip and the sink. * **Ease of Install:** It uses pre-drilled holes in the PCB, making it more secure than adhesive tapes in high-vibration environments. --- ### 4. Application Context This heat sink is categorized as a **Board Level** cooling solution. It is commonly used for: * **ASICs and FPGAs:** High-density chips that generate significant localized heat. * **Telecommunications:** Networking gear that requires 24/7 reliability. * **Embedded Systems:** Industrial PCs where mechanical stability is required. --- ### 5. Thermal Performance Data Performance varies based on Airflow Velocity (LFM - Linear Feet per Minute): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 5.31 | | 200 (1.0 m/s) | 1.79 | | 300 (1.5 m/s) | 1.27 | | 400 (2.0 m/s) | 1.05 |