The **ATS-08E-34-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for securing cooling solutions directly to Printed Circuit Boards (PCBs). ### Technical Specifications The following table summarizes the physical and thermal characteristics of this specific part number: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-08E-34-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W x H)** | 35mm x 35mm x 25mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 6.73°C/W (at 100 LFM) | | **Pressure Flow** | High-performance thermal interface material (pre-applied) | --- ### Key Electronic & Mechanical Components #### 1. Thermal Interface Material (TIM) The "C2" suffix in the part number indicates that the heat sink comes with **SAINT-GOBAIN C8000** thermal interface material. This is a high-performance phase-change material or tape that fills microscopic air gaps between the heat source (e.g., a CPU, FPGA, or GPU) and the aluminum base to maximize heat transfer. #### 2. Attachment Mechanism: Push-Pins The "R0" designation refers to the attachment kit. This model uses a **plastic push-pin** and a **compression spring**. * **Purpose:** Provides consistent pressure to ensure the TIM makes solid contact with the chip. * **Security:** The push-pins snap into pre-drilled holes on the PCB, making it more secure than simple adhesive tapes in high-vibration environments. #### 3. Fin Profile (Heat Dissipation) The heat sink features a **straight-fin** design. In electronics, this is optimized for "forced air" cooling (systems with fans). The spacing between the aluminum fins is calculated to minimize pressure drop while maximizing surface area for heat to escape into the airflow. --- ### Typical Applications This part is commonly found in the following electronic assemblies: * **Network Switches/Routers:** Cooling high-speed processing chips. * **Embedded Systems:** Industrial PCs where thermal throttling must be avoided. * **Power Supplies:** Cooling MOSFETs or power ICs. * **Telecommunications:** Cooling FPGA and ASIC components. ---