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  • ATS-08E-35-C2-R0

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    The **ATS-08E-35-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is specifically designed for cooling electronic components such as CPUs, GPUs, FPGAs, and other high-heat surface-mount devices. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Base Dimensions** | 35.00mm x 35.00mm | | **Height** | 10.00mm | | **Mounting Type** | Push-Pin (Plastic/Brass) | | **Fin Style** | Straight (Fine Pitch) | | **Attachment Method** | T766 Phase Change Material / Push-Pin | --- ### 2. Thermal Performance Data Thermal resistance measures how effectively the heat sink transfers heat away from the component into the surrounding air (measured in °C/W). Lower values indicate better performance. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 (0.5 m/s)** | 22.48 | | **200 (1.0 m/s)** | 10.21 | | **300 (1.5 m/s)** | 7.22 | | **500 (2.5 m/s)** | 5.25 | | **700 (3.5 m/s)** | 4.33 | --- ### 3. Key Electronic/Mechanical Features * **pushPIN™ Attachment:** This system features a flexible mounting mechanism that ensures precise pressure is applied to the electronic chip, optimizing thermal contact without damaging the PCB. * **Low Profile:** With a height of only 10mm, this part is ideal for high-density electronic assemblies where vertical space is limited (e.g., 1U servers or thin-profile embedded systems). * **C2 Material/Finish:** The "C2" suffix indicates a specific combination of blue anodized finish (which improves thermal radiation and prevents corrosion) and a specific thermal interface material (TIM). * **Pre-assembled Thermal Interface:** The part typically comes with a pre-applied thermal pad or phase-change material to ensure a consistent thermal bond between the chip and the heat sink. --- ### 4. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Brand) | | **08** | Specific Fin Design / Series | | **E** | Push-pin type/configuration | | **35** | 35mm width/length | | **C2** | Blue Anodized Finish | | **R0** | RoHS Compliant |
    ✨ Follow-up Questions
    • ⤷ What is the hole-to-hole spacing required on the PCB for this heat sink?
    • ⤷ Are there alternative heights available for the 35mm x 35mm base size?
    • ⤷ What is the recommended push-pin material for high-vibration environments?