The **ATS-08E-39-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the "blue ice" or high-performance push-pin series designed for cooling integrated circuits (ICs) and other electronic packages. ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Spring Type** | Compression Spring | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 12.70mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | ~1.89° C/W (at 200 LFM) | | **Flow Orientation** | Unidirectional | --- ### 2. Electronic/Thermal Performance The primary purpose of this part is to conduct heat away from a semiconductor device (like a CPU, FPGA, or GPU) and dissipate it into the surrounding air. * **Thermal Efficiency:** The straight-fin design is optimized for environments with consistent airflow (forced convection). The lower the thermal resistance (°C/W), the better the part is at keeping the electronic component cool. * **Thermal Interface Material (TIM):** This specific part number (C2) usually indicates the inclusion of a high-performance thermal pad or pre-applied phase-change material (T766) to ensure low contact resistance between the chip and the aluminum base. --- ### 3. Mechanical Mounting System The "Push-Pin" assembly is a critical electronic packaging feature: 1. **Uniform Pressure:** The springs ensure that the heat sink applies constant, even pressure across the surface of the electronic component, which prevents "hot spots." 2. **Ease of Assembly:** It allows for quick installation on a PCB (Printed Circuit Board) using pre-drilled holes, eliminating the need for messy adhesives or manual screwing. 3. **Vibration Resistance:** The spring-loaded mechanism makes it suitable for industrial or mobile electronics where vibration might cause rigid mounts to fail. --- ### 4. Typical Applications * **Telecommunications:** High-speed routers and switches. * **Computing:** Server CPUs and embedded controllers. * **Power Electronics:** Voltage regulators and high-power transistors.