The **ATS-08E-48-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Heat Sink** designed for cooling integrated circuits (ICs) and other electronic components. Below is a detailed breakdown of its specifications and electronic application. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by Advanced Thermal Solutions. Here are the key technical details: | Parameter | Specification | | :--- | :--- | | **Product Type** | Push-Pin Heat Sink | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 30.00mm x 30.00mm x 25.00mm | | **Attachment Method** | Push-Pin (Plastic) with Spring | | **Thermal Resistance** | 7.52°C/W (at 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (High Performance Pre-applied) | --- ### 2. Component Design Features The "electronic parts" of this assembly include more than just the metal block. It is a mechanical system designed to protect sensitive electronics: * **Fin Profile (High Performance):** The "E" in the part number often refers to the fin density and geometry, optimized for both natural and forced convection environments. * **Push-Pin Attachment:** Instead of using adhesive tape (which can fail under high heat), this part uses two plastic push-pins. These provide a constant pressure (clamping force) on the electronic chip, ensuring maximum thermal contact. * **Compression Spring:** Located on the push-pin, it compensates for thermal expansion and mechanical shock, preventing the heat sink from cracking the delicate silicon die. * **T766 TIM:** This is a phase-change material or high-conductivity grease pre-applied to the base. It fills the microscopic air gaps between the chip surface and the aluminum. --- ### 3. Electronic Application This heat sink is typically used on the following electronic components: 1. **BGA Packages:** Ball Grid Array chips like FPGAs, CPUs, or high-speed Network Processors. 2. **Power Electronics:** MOSFET modules or voltage regulators that generate significant heat. 3. **High-Speed PCB Design:** In systems where airflow is directed via fans (forced convection), the fin height (25mm) is designed to capture high volumes of air. ### 4. Part Number Breakdown * **ATS:** Manufacturer (Advanced Thermal Solutions). * **08E:** Series designation (Fin geometry). * **48:** Width/Length identifier. * **C2:** Material/Color code (Aluminum/Blue Anodized). * **R0:** Revision or RoHS compliance status. ---