The **ATS-08E-65-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the *maxiFLOW™* product line, designed to optimize airflow and heat dissipation for electronic components like CPUs, GPUs, and ASICs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 25.00mm | | **Fin Style** | Straight | | **Thermal Resistance** | 6.69°C/W (at 100 LFM) | | **Pressure Drop** | High performance maxiFLOW™ design | --- ### 2. Key Electronic Components & Design The "electronic" utility of this part is defined by its mechanical interface with PCB components: #### A. Thermal Interface Material (TIM) The "R0" suffix indicates that this part typically comes with a pre-applied **Phase Change Material (PCM)** or high-performance thermal pad. This ensures there are no air gaps between the semiconductor die and the aluminum base, maximizing heat transfer. #### B. pushPIN™ Attachment System Rather than using messy adhesives, this part utilizes a spring-loaded push-pin system. - **Springs:** Provide consistent pressure (Force) to ensure the heat sink remains seated during mechanical shock or vibration. - **Hardware:** Brass or plastic pins that lock into pre-drilled holes on the PCB. #### C. maxiFLOW™ Fin Geometry The fins are designed with a specific taper. In electronic enclosures with limited airflow, this geometry reduces "pressure drop," allowing air to move more freely through the fins compared to standard extruded heat sinks. --- ### 3. Application Use Cases This part is commonly found in the following electronic assemblies: 1. **Network Switches/Routers:** Cooling high-speed processing chips. 2. **Power Supplies:** Managing heat for MOSFETs or power regulators. 3. **Embedded Systems:** Industrial PCs where active fan cooling may not be feasible. --- ### 4. Part Number Breakdown ```text ATS - 08 E - 65 - C2 - R0 | | | | | | | | | └─ Thermal Interface Material (Pre-applied) | | | └────── Color/Finish (Blue Anodized) | | └─────────── Specific Fin/Height Configuration | └────────────────── Attachment Type (pushPIN™) └──────────────────────── Advanced Thermal Solutions (Manufacturer) ```