The **ATS-08E-79-C2-R0** is a high-performance electronic thermal management component. Specifically, it is an **Advanced Thermal Solutions (ATS) push-pin heat sink** designed for cooling integrated circuits (ICs) such as CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Number** | ATS-08E-79-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 26.36°C/W (Natural Convection) | | **Dimensions (L x W x H)** | 25.00mm x 25.00mm x 30.00mm | | **Fin Style** | Straight (High-flow design) | --- ### 2. Breakdown of the Component Parts The assembly consists of three primary "parts" that work together to provide electronic cooling: #### A. The Heat Sink Body * **Design:** This is a "super-fine pitch" straight-fin heat sink. The vertical fins increase the surface area to dissipate heat into the surrounding air. * **Material:** Made from **AL6063 aluminum**, which offers high thermal conductivity while remaining lightweight. * **Coating:** The blue anodized finish is not just for aesthetics; it provides corrosion resistance and slightly improves radiant heat transfer. #### B. The Attachment Mechanism (Push-Pins) * **Spring-Loaded Pins:** The "E" in the part number signifies a specific push-pin configuration. These are plastic pins with internal springs. * **Function:** They provide consistent pressure (compression) between the heat sink and the electronic chip, which is critical for minimizing thermal resistance. #### C. Thermal Interface Material (TIM) * **Pre-Applied Interface:** This specific model usually comes with a pre-applied **Thermal Phase Change Material** or a high-performance thermal pad on the base. * **Purpose:** It fills the microscopic air gaps between the chip surface and the heat sink base to maximize heat transfer efficiency. --- ### 3. Application Context In an electronic circuit, the ATS-08E-79-C2-R0 is used for: 1. **Passive Cooling:** In low-power environments where natural airflow is sufficient. 2. **Active Cooling:** Placed in the path of a system fan to significantly drop temperatures (thermal resistance can drop from 26.36°C/W to as low as 4.10°C/W under high airflow). ---