The **ATS-08E-82-C2-R0** is a high-performance thermal management component, specifically an **Aluminum Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The model number provides specific details about its physical and thermal properties: | Property | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Brass pins with springs) | | **Heat Sink Type** | pushPIN™ HS Assembly | | **Fin Type** | Straight Fin | | **Thermal Resistance** | 10.79 °C/W (at 100 LFM) | | **Weight** | ~30 grams | ### 2. Physical Dimensions Precision sizing is critical for ensuring the heat sink fits within the PCB constraints without interfering with other surface-mount devices (SMDs). | Dimension | Value (mm) | | :--- | :--- | | **Length (A)** | 30.00 mm | | **Width (B)** | 30.00 mm | | **Height (C)** | 15.00 mm | | **Pitch (E)** | 35.00 mm | | **Pitch (F)** | 35.00 mm | --- ### 3. Key Features and Electronic Applications #### A. Thermal Performance This heat sink uses a "Straight Fin" design. In electronics, this is ideal for **unidirectional airflow** environments (e.g., inside a server chassis or a desktop PC where air is blown in a specific direction). #### B. The pushPIN™ Attachment Unlike adhesive tapes or simple clips, the `pushPIN™` system ensures: * **Constant Pressure:** The spring-loaded mechanism provides consistent contact with the electronic chip, maximizing thermal transfer. * **Secure Mounting:** It is vibration-resistant, making it suitable for industrial or automotive electronics. #### C. Material & Coating * **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodizing:** This is not just for aesthetics; the anodized layer provides slight electrical insulation and corrosion resistance, which is vital in high-humidity or harsh electronic environments. --- ### 4. Typical Use Cases * **Embedded Systems:** Cooling small-form-factor processors. * **Power Supplies:** Dissipating heat from MOSFETs or Voltage Regulators. * **Telecommunications:** Cooling ASICs in networking hardware (switches/routers).