The **ATS-08E-85-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" series designed for cooling electronic components such as CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific model: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 22.98°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 10.00mm | | **Fin Style** | Straight Fin | | **TIM (Thermal Interface Material)** | T766 (Pre-applied) | --- ### 2. Key Components & Design Features #### A. The Fin Structure The "Straight Fin" design is optimized for environments where there is a consistent, directional airflow. The 10mm height allows it to fit in low-profile enclosures while still providing a significant surface area for heat dissipation. #### B. Attachment Mechanism (Push-Pins) The part uses a **plastic push-pin** system with a compression spring. This provides several advantages: * **Constant Pressure:** The spring ensures the heat sink stays firmly against the component, maximizing thermal transfer. * **Ease of Assembly:** It can be installed quickly on a PCB with pre-drilled holes (typically 3.0mm holes). #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. This is a "Phase Change" material that softens when the component heats up, filling microscopic air gaps between the heat sink and the chip to improve thermal conductivity. --- ### 3. Thermal Performance Profile Thermal performance varies based on the Airflow (Measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Static/Natural) | 22.98 | | 300 (Active Fan) | 8.88 | | 500 (High Velocity) | 6.41 | --- ### 4. Application Use Cases * **Embedded Systems:** Ideal for ARM-based processors or FPGAs in industrial controllers. * **Telecommunications:** Used in routers and switches for cooling chipsets. * **Power Electronics:** Cooling voltage regulators or small power modules.