The **ATS-08E-91-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 40mm x 40mm x 10mm | | **Fin Style** | Straight (Fine Pitch) | | **Attachment Method** | pushPIN™ (Plastic/Brass pins) | | **Thermal Resistance** | 21.97 °C/W (at 100 LFM) | --- ### 2. Key Features and Components The part is characterized by its specific mechanical design intended for high-density PCB layouts. * **Heat Sink Profile:** It features a low-profile design (10mm height), making it ideal for systems with limited vertical clearance. * **Fin Geometry:** The straight fin design is optimized for unidirectional airflow. The high fin density increases the surface area for heat exchange. * **pushPIN™ Attachment:** Instead of messy adhesives or simple clips, this part uses a spring-loaded push-pin system. This ensures consistent pressure (TIM - Thermal Interface Material compression) and reliable mechanical mounting. * **Thermal Interface Material (TIM):** Typically, these units come pre-applied with a high-performance thermal pad or grease (such as T766) to ensure minimal air gaps between the component and the sink. --- ### 3. Electronic Application This component is used in the following electronic contexts: 1. **Passive Cooling:** It operates by conducting heat away from the semiconductor die and radiating it into the surrounding air. 2. **Forced Air Integration:** While it can work in natural convection, it is specifically engineered for systems with fans where air is forced through the fins. 3. **Circuit Protection:** By keeping the junction temperature ($T_j$) of a semiconductor below its maximum rating, it prevents thermal throttling and permanent hardware failure. --- ### 4. Part Number Breakdown The nomenclature `ATS-08E-91-C2-R0` can be decoded as follows: * **ATS:** Advanced Thermal Solutions. * **08:** Specific series identifier. * **E:** Size/Mounting configuration. * **91:** Fin design/Height variant. * **C2:** Material/Thermal performance grade (Blue Anodized). * **R0:** RoHS compliance status.