The **ATS-08E-98-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **heat sink** manufactured by Advanced Thermal Solutions (ATS) as part of their "push pin" series. --- ### 1. Technical Specifications The following table summarizes the physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Type** | Heat Sink (Passive Cooling) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push Pin (Plastic) / Brass Springs | | **Dimensions (L x W x H)** | 45mm x 45mm x 20mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 15.31°C/W (at 100 LFM) to 1.51°C/W (at 800 LFM) | | **TIM (Thermal Interface)** | T766 (High Performance Pre-applied) | --- ### 2. Key Components & Materials #### A. The Heat Sink Body The body is constructed from **Aluminum 6063**, chosen for its excellent thermal conductivity and lightweight properties. The **Blue Anodized** finish provides: * Increased surface emissivity for better radiative cooling. * Protection against corrosion and environmental wear. * Electrical insulation to prevent short circuits if contact occurs. #### B. The Attachment Mechanism (Push Pins) Instead of adhesive tapes or screws, this part uses a **Push Pin** system: * **Material:** Plastic pins with Brass springs. * **Function:** It provides a constant, specific pressure (load) on the processor/chip, ensuring optimal contact with the thermal interface material without damaging the PCB. #### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. This is a phase-change or high-performance pad that fills microscopic air gaps between the electronic component (CPU/FPGA) and the heat sink to maximize heat transfer. --- ### 3. Electronic Application This part is typically used to cool medium-to-high power integrated circuits (ICs) such as: 1. **Processors (CPUs/GPUs):** For embedded systems. 2. **FPGAs:** High-speed field-programmable gate arrays. 3. **ASICs:** Application-specific integrated circuits in networking hardware. 4. **Power Electronics:** Voltage regulators that generate significant heat during operation. --- ### 4. Cooling Performance Curve The effectiveness of the ATS-08E-98-C2-R0 is highly dependent on airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural/Low) | 15.31 | | 400 (Moderate) | 2.34 | | 800 (High) | 1.51 |