The **ATS-08F-03-C3-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed by Advanced Thermal Solutions (ATS) for cooling integrated circuits (ICs) and other electronic components. Below is a detailed breakdown of its specifications and electronic characteristics. --- ### 1. Technical Specifications The part belongs to the **pushPIN™** series, designed for secure attachment and efficient heat dissipation. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded bolts) | | **Thermal Resistance** | 15.97°C/W (at 100 LFM) | | **Dimensions (L x W)** | 40mm x 40mm | | **Height (Fin Depth)** | 15mm | | **Fin Pattern** | Fine Pitch (XC-CUT) | --- ### 2. Component Design Details #### A. Thermal Performance The efficiency of this part is measured by its thermal resistance. As airflow increases, the resistance drops, allowing the electronic component to run cooler: * **@100 LFM (0.5 m/s):** 15.97 °C/W * **@500 LFM (2.5 m/s):** 4.56 °C/W * **@700 LFM (3.5 m/s):** 3.58 °C/W #### B. Mechanical Interface * **Push-Pins:** These provide the necessary pressure to ensure the thermal interface material (TIM) makes perfect contact with the chip. * **Springs:** Usually brass or steel, providing consistent force to prevent the heatsink from shifting during mechanical shock or vibration. * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T412** thermal tape or grease to fill microscopic air gaps between the chip and the aluminum. #### C. XC-CUT Pattern The "XC-CUT" refers to the fin geometry. Unlike straight fins, the cross-cut design allows for multidirectional airflow, which is critical in densely packed electronic enclosures where air may not flow in a perfectly straight line. --- ### 3. Application in Electronics This part is commonly found in the following electronic systems: 1. **Telecommunications:** Cooling high-speed processors in routers and switches. 2. **Embedded Systems:** For industrial motherboards where vertical space is limited to 15mm. 3. **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators. ---