The **ATS-08F-04-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to describe its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Material** | Aluminum (Al 6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 40mm x 40mm | | **Height** | 20mm | | **Thermal Resistance** | 11.60°C/W (at 100 LFM) to 1.60°C/W (at 700 LFM) | | **TIM (Interface Material)** | T412 (Pre-applied) | --- ### 2. Key Components & Design The ATS-08F-04-C3-R0 is engineered with specific features to maximize cooling efficiency in restricted spaces: * **Fin Design (XC-CUT):** This heat sink features a "Cross-Cut" fin pattern. This design allows for multi-directional airflow, making it effective in systems where the direction of the air from cooling fans might vary. * **Push-Pin Mounting:** Unlike adhesive-based heat sinks, this uses a mechanical push-pin system with a compression spring. This ensures constant pressure on the electronic component, which optimizes heat transfer. * **Thermal Interface Material (TIM):** It comes with **T412** pre-applied to the base. T412 is a high-performance thermal pad that fills microscopic air gaps between the heat sink and the chip. * **Blue Anodized Coating:** The surface is treated with blue anodization to increase corrosion resistance and slightly improve radiation heat transfer. --- ### 3. Thermal Performance Data Performance varies based on the Airflow (measured in Linear Feet per Minute - LFM): | Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 11.58 | | 300 (1.5 m/s) | 4.05 | | 500 (2.5 m/s) | 2.50 | | 700 (3.5 m/s) | 1.90 | --- ### 4. Applications This part is typically used in: * **Telecommunications:** Cooling of high-speed network switches. * **Computing:** Secondary cooling for chipsets or power delivery modules (VRMs). * **Industrial:** High-density power supplies and embedded systems.