The **ATS-08F-05-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for efficient cooling of semiconductors and PCBs. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 25.00 °C/W (at 100 LFM) | | **Flow Type** | XCUT (Cross-cut / Pin Fin) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 25.00mm | | **Pitch** | Fine Pitch | --- ### 2. Key Component Features #### A. XCUT (Cross-Cut) Fin Design Unlike standard straight-fin heat sinks, the XCUT design features gaps between fins. This allows air to enter and exit from multiple directions, making it ideal for systems with **non-linear or turbulent airflow**. #### B. pushPIN™ Attachment System The "R0" suffix refers to the specific attachment mechanism: * **Spring-loaded:** Ensures a constant and uniform pressure against the electronic component (CPU, FPGA, or MOSFET). * **Reliability:** Prevents the heat sink from shifting during vibration or shipping. * **Easy Installation:** Uses pre-drilled holes in the PCB. #### C. Thermal Performance The "C3" designation typically refers to the thermal interface material (TIM) or the specific heat sink performance grade. This model is optimized for **low-flow environments**, maintaining a balance between physical height (25mm) and surface area. --- ### 3. Applications This part is commonly used in the following electronic sectors: 1. **Telecommunications:** Cooling of high-speed network processors. 2. **Embedded Systems:** Industrial PCs where space is limited but heat dissipation is critical. 3. **Power Electronics:** Cooling of power converters and motor drivers. ---