The **ATS-08F-104-C2-R1** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** series, designed to provide efficient cooling for electronic components like CPUs, GPUs, and other integrated circuits. --- ### 1. Technical Specifications The following table details the physical and thermal characteristics of this specific component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (LxWxH)** | 40mm x 40mm x 25mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 2.52 °C/W (at 100 LFM) | | **Fin Style** | Fine Pitch (Rectangular) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Breakdown of the Part Number The part number is structured to define specific build parameters: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **08**: Heat sink height (25mm in this series configuration). * **F**: Fin pitch/density (indicates a fine-pitch configuration). * **104**: Specific geometry and hole pattern code. * **C2**: Material and finish code (usually Al 6063 with Blue Anodized finish). * **R1**: Revision or packaging code. --- ### 3. Key Electronic Functions The ATS-08F-104-C2-R1 serves three primary functions in an electronic assembly: 1. **Thermal Dissipation**: It increases the surface area of a heat-generating component, allowing air to carry away heat more effectively via convection. 2. **Component Protection**: By keeping the junction temperature ($T_j$) of a semiconductor within safe limits, it prevents thermal throttling and hardware failure. 3. **Mechanical Attachment**: The **pushPIN™** system uses a flexible, spring-loaded mechanism that ensures consistent pressure across the thermal interface, which is critical for heat transfer efficiency. --- ### 4. Application Use-Cases * **Networking Equipment**: Switches and routers where airflow is managed but space is limited. * **Industrial PCs**: For rugged environments requiring secure mechanical attachment (vibration resistance). * **Power Electronics**: Cooling MOSFETs or small power modules.