The **ATS-08F-107-C2-R1** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** series, designed to provide efficient cooling for electronic components like processors, FPGAs, and ASICs. ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 50.00mm x 50.00mm x 12.70mm | | **Fin Pattern** | Fine Pitch (Cross-Cut) | | **Attachment Method** | pushPIN™ (Spring-loaded bolts) | | **Thermal Resistance (Unducted)** | 12.18 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 1.90 °C/W @ 200 LFM | --- ### 2. Key Features and Components * **PushPIN™ Attachment:** This model uses a spring-loaded mechanism that ensures precise pressure (TIM compression) and secure mounting to the PCB, preventing damage to the delicate silicon die. * **Cross-Cut Fin Design:** The "Fine Pitch" pattern increases surface area and allows for multi-directional airflow, making it highly effective in compact electronic enclosures. * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T766** thermal grease, which ensures maximum heat transfer between the component and the heat sink. * **Compliance:** It is RoHS (Restriction of Hazardous Substances) and REACH compliant, making it suitable for global industrial and consumer electronics. --- ### 3. Part Number Breakdown Understanding the nomenclature helps in identifying variations of this part: 1. **ATS:** Manufacturer (Advanced Thermal Solutions). 2. **08:** Series/Attachment type. 3. **F:** Material/Fin type (Fine Pitch). 4. **107:** Specific dimensions/profile. 5. **C2:** Material grade and Thermal Interface type. 6. **R1:** Revision or Packaging code. --- ### 4. Typical Applications * **Embedded Systems:** Cooling for ARM-based processors. * **Networking:** Heat dissipation for high-speed switches and routers. * **Industrial PC:** Cooling modules in fanless or low-airflow environments.