The **ATS-08F-11-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for efficient cooling of integrated circuits (ICs) like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications The following table highlights the primary physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 50.00mm x 50.00mm x 10.00mm | | **Fin Style** | XCUT (Fine pitch) | | **Thermal Resistance** | 18.78 °C/W (Unducted @ 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Design and Engineering Features ### A. XCUT Fin Profile The "XCUT" geometry features a cross-cut fin design. This provides several advantages: * **Omnidirectional Airflow:** It can accept air from multiple directions, making it ideal for systems where the airflow path is not strictly linear. * **Increased Surface Area:** The cross-cuts increase the total surface area available for heat dissipation compared to standard straight fins. ### B. pushPIN™ Attachment System The part uses a specialized mechanical attachment system instead of simple adhesive: * **Compression Springs:** Ensures consistent pressure between the heat sink and the component, optimizing heat transfer. * **Plastic/Brass Push Pins:** Designed for quick installation into pre-drilled holes on the PCB (usually 3.175mm or 4mm holes). ### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. This is a high-performance thermal grease/pad that fills microscopic air gaps between the heat sink and the chip to ensure maximum thermal conductivity. --- ### 3. Thermal Performance Comparison Thermal resistance varies based on the velocity of the air passing through the fins (LFM = Linear Feet per Minute): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 18.78 | | 300 (1.5 m/s) | 4.92 | | 500 (2.5 m/s) | 2.67 | | 700 (3.5 m/s) | 1.82 | --- ### 4. Part Number Breakdown * **ATS:** Advanced Thermal Solutions (Manufacturer) * **08:** Series/Model identifier * **F:** Fin Pitch (Fine) * **11:** Height (10mm + tolerance) * **C2:** Thermal Interface Material / Color code * **R0:** Revision/RoHS Status