The **ATS-08F-111-C2-R1** is a high-performance electronic thermal management component, specifically a **heat sink** designed for cooling integrated circuits and power modules. It is manufactured by Advanced Thermal Solutions (ATS). --- ## 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal properties. | Specification | Details | | :--- | :--- | | **Component Type** | Heat Sink | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 60mm x 60mm x 30mm | | **Thermal Resistance** | 2.67°C/W (Unducted @ 100 LFM) | | **Fin Pattern** | XCEL (Straight Fin) | --- ## 2. Key Electronic Properties ### Thermal Dissipation This part is designed to dissipate heat from surface-mount components like CPUs, GPUs, or high-power MOSFETs. By increasing the surface area, it prevents thermal throttling and electronic failure due to overheating. ### The pushPIN™ Mechanism Unlike adhesive-based heat sinks, the "pushPIN" system uses a flexible, spring-loaded mechanism. This ensures: * **Constant Pressure:** Maintains optimal contact between the heat sink and the electronic component. * **Mechanical Reliability:** Reduces the risk of the heat sink falling off due to vibration or thermal expansion. --- ## 3. Physical Attributes The following table outlines the physical dimensions required for PCB layout integration: | Dimension | Measurement (mm) | | :--- | :--- | | **Length (A)** | 60.00 | | **Width (B)** | 60.00 | | **Height (C)** | 30.00 | | **Pitch (E)** | 53.00 | | **Pitch (F)** | 53.00 | --- ## 4. Application Context The **ATS-08F-111-C2-R1** is typically found in: 1. **Telecommunications:** High-speed routers and switches. 2. **Industrial Controls:** Power converters and motor drivers. 3. **Computing:** Server motherboards and storage arrays.